SiC陶瓷与钛合金（Ag-Cu-Ti）-SiCp复合钎焊接头组织结构研究

用合金化的Ag-Cu-Ti粉及SiC粉组成的混合粉末钎料,真空无压钎焊SiC陶瓷和Ti合金.研究结果表明,在Ag-Cu-Ti粉末钎料中加入15vol%～30vol%SiC粉末能明显降低接头热应力,获得完整的SiC颗粒增强的复合接头.加入的SiC颗粒、SiC陶瓷母材均与连接层中的Ti起反应,形成表面反应层Ti3SiC2及分布于Ag-Cu-Ti合金中的Ti-Si化合物,随SiC颗粒增加,反应层变薄.连接层中的Cu元素与连接的Ti合金相互扩散,形成Cu-Ti相界面扩散带.     

SiC陶瓷与钛合金(Ag-Cu-Ti)-SiCp复合钎焊接头组织结构研究

用合金化的Ag-Cu-Ti粉及S iC粉组成的混合粉末钎料,真空无压钎焊S iC陶瓷和Ti合金。研究结果表明,在Ag-Cu-Ti粉末钎料中加入15vol%~30vol%S iC粉末能明显降低接头热应力,获得完整的S iC颗粒增强的复合接头。加入的S iC颗粒、S iC陶瓷母材均与连接层中的Ti起反应,形成表面反应层Ti3S iC2及分布于Ag-Cu-Ti合金中的Ti-S i化合物,随S iC颗粒增加,反应层变薄。连接层中的Cu元素与连接的Ti合金相互扩散,形成Cu-Ti相界面扩散带。     

TiAl合金与42CrMo扩散钎焊的界面组织及形成机理

使用真空扩散钎焊方法对870℃下TiAl/B-Ag72Cu/42CrMo进行了连接,利用金相显微镜、扫描电镜、电子探针成分线分析及成分定量分析等方法研究了TiAl/B-Ag72Cu/42CrMo扩散钎焊接头组织及接头反应层的形成机理.界面分析显示,B-Ag72Cu/42CrMo的界面未形成金属间化合物,而TiAl/B-Ag72Cu的界面上有Ti(Cu,Al)2金属间化合物产生.分析了连接接头金属间化合物的形成和长大机制,钎焊接头金属间化合物的形成和长大机制,分为等温凝固和冷却凝固两个阶段.元素的扩散是控制接头形成的主要因素.连接界面金属间化合物的形成和长大主要有钎料的熔化、沿晶界优先扩散、等温凝固、柱状和蘑菇状长大及纵向长大几个过程.     

利用金属间化合物增强陶瓷钎焊接头强度

研究了Ag-Cu-Ti/加Ti/N i/Ti复合层钎焊S i3N4陶瓷的接头组织与性能。结果表明,钎缝中形成了以金属间化合物为高熔点相和Ag-Cu作为基体的组织。对界面反应层的观察表明,反应层分为两层结构。保温时间、连接温度、Ti箔和N i箔厚度及Ag-Cu-Ti钎料厚度均能影响接头组织和强度。在本实验范围内,其它参数一定的条件下,分别在30m in,970℃,Ti箔30μm和N i箔60μm及Ag-Cu-Ti片150μm时取得了最大强度值。     

采用Ti-15Cu-15Ni钎料的TiAl/42CrMo钢接头组织及形成机理

采用Ti-15Cu-15Ni钎料对TiAl基合金与42CrMo钢进行真空钎焊连接.利用扫描电镜、能谱等分析方法研究TiAl/42CrMo钢接头的组织及成分分布.结果表明,TiAl/42CrMo钢接头中分别在TiAl基合金母材和42CrMo钢附近形成过渡反应层区,钎缝中出现Ti-Al,Ti-Cu(Ni),Ti-Fe等相.简单阐述接头的形成机理.     

C_f/SiC复合材料与Ti合金的AgCuTi-W复合钎焊

本文利用AgCuTi-W复合钎料作中间层,在适当的工艺参数下真空钎焊Cf／SiC复合材料与Ti合金,利用SEM,EDS,XRD分析接头微观组织结构,利用剪切试验检测接头力学性能。研究结果表明：钎焊时,复合钎料中的Ti借助Cu-Ti液相与Cf／SiC复合材料反应,在Cf／SiC复合材料与连接层界面形成Ti3SiC2,Ti3Si和少量TiC化合物的混合反应层。复合钎料中的Cu与Ti合金中的Ti发生互扩散,在连接层与Ti合金界面形成不同成分的Cu—Ti化合物过渡层。钎焊后,形成W颗粒强化的致密复合连接层,W颗粒主要分布在Cu-Ti相中。W的加入缓解了接头的残余热应力,Cf／SiC／AgCuTi—W／TC4接头剪切强度明显高于CF／SiC／AgCuTi／TC4接头。     

TA15钛合金扩散钎焊界面微观组织及性能研究

采用钛基钎料Ti37.5Zr15Cu10Ni作为中间层对TA15钛合金进行了真空扩散钎焊,对扩散钎焊接头界面微观组织进行了分析,同时测试了接头室温和液氮低温力学性能。试验结果表明:钎料与TA15基体发生了快速的互扩散,焊缝微观组织全部呈针状,接头室温和液氮低温状态下均脆断于焊缝,室温拉伸强度达到基体材料拉伸强度的93.8%。     

BNi-2非晶钎料钎焊高铌TiAl合金与GH3536合金接头组织与性能

采用非晶态BNi-2钎料成功实现了高铌TiAl合金与GH3536合金的连接,获得良好的钎焊接头。钎焊接头的典型界面组织为TAN/B2+τ3/τ4+（Ni-Ti）-B/γ+（Ni-Ti）-B+CrB+G相/GH3536。通过分析钎焊温度对接头界面微观组织的影响,表明BNi-2钎料中B元素的扩散以及GH3536合金向液态钎料中的溶解对界面组织结构演变起着至关重要的作用。而随着钎焊温度的升高,扩散IV区逐渐消失,接头由4个区域变为3个区域,τ3/τ4化合物层及钎缝区域均逐渐增厚,黑色CrB相发生粗化,细小点状（Ni,Ti）-B含量减少。1 160℃保温10 min时,所获得的钎焊接头最大室温及高温（700℃）抗剪强度分别为~106.8 MPa和~76.2 MPa,其剪切强度降低约28.6%,接头均呈现脆性断裂模式。接头形成过程可以划分为固相扩散、液相生成、等温扩散凝固和残余液相析出4个阶段。     

SiO2f/SiO2复合材料自身及其与铜、不锈钢的钎焊

采用AgCuTi活性钎料,在880℃/10min规范下成功实现了SiO2f/SiO2自身、SiO2f/SiO2与Cu和SiO2f/SiO2与1Cr18Ni9Ti三种接头的连接。实验结果表明,三种接头中靠近SiO2f/SiO2母材的界面处均形成了一层薄薄的扩散反应层组织,反应层中出现了Ti和O的富集,根据两者的原子比例推断生成了TiO2相;另外,三种接头中心区都形成了由灰色相和白色相共同组成的Ag-Cu共晶组织,其中灰色相为Cu基固溶体,白色相为Ag基固溶体。接头剪切强度结果显示,SiO2f/SiO2/Cu接头剪切强度为12.4MPa,SiO2f/SiO2/1Cr18Ni9Ti接头剪切强度为18.4MPa,接头中的残余应力是决定接头强度大小的重要因素之一。     

以Ti/V/Cu、V/Cu为中间层的TiAl合金

用真空扩散连接方法对TiAl/Ti/V/Cu/40Cr钢及TiAl/V/Cu/40Cr钢进行了研究。结果表明,以Ti/V/Cu作中间层的接头拉伸强度高于以V/Cu作中间层的接头强度。界面分析显示,Ti/V、V/Cu、Cu/40Cr钢的各个结合界面处未形成金属间化合物,而TiAl/Ti的结合界面上有Ti3Al产生;在TiAl/V的界面上有Ti3Al、Al3V两种金属间化合物产生;界面上脆性金属间化合物的产生是接头发生断裂的原因。     

Brazing diamond grits onto AA7075 aluminium alloy substrate with Ag–Cu–Ti filler alloy by laser heating

The brazing of diamond is a promising way to fabricate grinding wheels for efficient machining and precision grinding. This work investigated the feasibility of bonding diamond grits onto Aluminium Alloy 7075 (AA7075) substrate with a Ag–Cu–Ti filler alloy via laser fusion brazing. The interfacial microstructures and the strength of the brazed diamond joints were studied. The cross-section of the brazed diamond joint consists of a molten filler alloy layer, a molten pool, a heat effect zone, a columnar crystal zone and an equiaxed crystal zone. Within the interface of the filler alloy/substrate metal, microstructures observed possibly were Ag(s.s), Al(s.s), TixAl, Al2Cu and Mg intermetallic compounds. A layer of TiC with a thickness of about 30–50 nm was found at the bonding interface of the diamond/filler alloy. The averaged peak shear force of the brazed joints was found to be approximately 39.8 N. The abrasion grinding test indicated that the diamond/AA7075 brazed joint was adequate for grinding. However, the pulled-off of grit was found to be the primary failure of this type of brazed joint. This work broadened the brazing diamond technique and the range of applications of brazed diamond wheels for efficient grinding.     

Joining of SiO2 ceramic and TC4 alloy by nanoparticles modified brazing filler metal

Nano-Al₂O₃ particles modified AgCuNi filler was adopted to braze the SiO₂ ceramic and TC4. The effects of filler size as well as the brazing temperature on the interfacial microstructure and mechanical property of the joints were investigated. Nanoscale filler reduced the phases dimension and promoted the homogeneous distribution of microstructure, obtaining a higher joint strength when compared to microscale filler. The increase of brazing temperature made the accelerating dissolution and diffusion of Ti, which promoted the increase of thickness of Ti₄O₇ + TiSi₂ layer adjacent to SiO₂ ceramic and diffusion layer zone nearby TC4 alloy. The hypoeutectic structure was produced in the brazing seam due to the high Ti content. The maximum shear strength of ∼40 MPa was obtained at 950 °C for 10 min.     

钴对钛基钎料钎焊Ti3Al的影响

研究了Co的添加对Ti-Zr-Ni-Cu钎料的性能,以及对Ti3Al基合金钎焊接头的显微组织和机械性能的影响。研究结果表明:采用添加Co的钎料,具有良好的润湿性和流动性,可显著提高钎焊接头的拉伸强度。     

Investigation on induction brazing of profiled cBN wheel for grinding of Ti-6Al-4V

Profiled monolayer cBN wheel was induction brazed for grinding of titanium dovetail slot in this study. Aimed at acquiring a uniform temperature distribution along the profiled surface and reducing the thermal deformation of the brazed wheel, a finite element model was established to investigate the temperature uniformity during induction brazing. A suitable induction coil and the related working parameters were designed and chosen based on the simulation results. Ag-Cu-Ti alloy and cBN grains were applied in the induction brazing experiment. The results showed geometric deformation of the brazed wheel was no more than 0.01 mm and chemical reaction layer were found on the brazed joint interface. Further validation tests were carried out by grinding of Ti-6Al-4V alloy. Compared to the electroplated wheel, the brazed wheel showed better performance such as low specific grinding energy and good ground quality in grinding of Ti-6Al-4V alloy. Abrasion wear was found to be the main failure mode for the induction brazed wheel, while adhesion and grains pull-out were the main failure mode for the electroplated wheel.     

TC1钛合金蜂窝夹层结构的钎焊工艺研究与分析

研究了TC1钛合金蜂窝夹层结构试件的钎焊工艺,通过对系列工艺下钎焊界面组织进行观察得出,在930℃/保温15min和一定钎料添加量的条件下,界面析出了TiNi2(Cu,Zr)化合物,且尺寸细小、分布弥散,因而相应钎焊试件的室温拉脱强度平均值较高,可达17MPa。在钎焊过程中,Cu和Ni元素由钎料向母材扩散,使母材β相变温度降低,导致界面魏氏体组织的产生;芯体波纹带间受钎料熔化热影响较大,导致此处魏氏体组织粗大,成为试件的薄弱部位。