首页 | 本学科首页   官方微博 | 高级检索  
     检索      

以Ti/V/Cu、V/Cu为中间层的TiAl合金
引用本文:何鹏%张秉刚%冯吉才%钱乙余.以Ti/V/Cu、V/Cu为中间层的TiAl合金[J].宇航材料工艺,2000,30(4):53-57.
作者姓名:何鹏%张秉刚%冯吉才%钱乙余
作者单位:哈尔滨工业大学现代焊接生产技术国家重点实验室 哈尔滨 150001
摘    要:用真空扩散连接方法对TiAl/Ti/V/Cu/40Cr钢及TiAl/V/Cu/40Cr钢进行了研究。结果表明,以Ti/V/Cu作中间层的接头拉伸强度高于以V/Cu作中间层的接头强度。界面分析显示,Ti/V、V/Cu、Cu/40Cr钢的各个结合界面处未形成金属间化合物,而TiAl/Ti的结合界面上有Ti3Al产生;在TiAl/V的界面上有Ti3Al、Al3V两种金属间化合物产生;界面上脆性金属间化合物的产生是接头发生断裂的原因。

关 键 词:扩散连接,界面反应,TiAl,Ti
修稿时间:1999年11月17

Diffusion Bonding of TiAl to 40Cr Steel with Interlayers Ti/V/Cu and V/Cu
He Peng,Zhang Binggang,Feng Jicai,Qian Yiyu.Diffusion Bonding of TiAl to 40Cr Steel with Interlayers Ti/V/Cu and V/Cu[J].Aerospace Materials & Technology,2000,30(4):53-57.
Authors:He Peng  Zhang Binggang  Feng Jicai  Qian Yiyu
Institution:National Key Laboratory of Advanced Welding Production Technology HIT Harbin 150001
Abstract:Diffusion bonding processes and its joint properties of TiAl to 40Cr are studied in this paper.Experiments indicate that tensile strength of the TiAl/Ti/V/Cu/40Cr joint is higher than that of TiAl/V/Cu/40Cr joint.Intermetallic compounds and other brittle phases are not found in the joint region of Ti/V, V/Cu,Cu/40Cr,while Ti 3Al is formed at interface of the TiAl/Ti,and Ti 3Al and Al 3V are formed at intrface of the TiAl/V.It is considered that fracture of the joints is caused by these brittle intermetallics at interface.
Keywords:Diffusion bonding  Interface reacting  TiAl  Ti  3Al  
本文献已被 CNKI 万方数据 等数据库收录!
点击此处可从《宇航材料工艺》浏览原始摘要信息
点击此处可从《宇航材料工艺》下载免费的PDF全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号