Effect of interface debonding on matrix multicracking evolution of fiber-reinfroced ceramic-matrix composites

An analytical methodology was developed to investigate the effect of fiber/matrix interface debonding on matrix multicracking evolution of fiber-reinforced CMCs(ceramic-matrix composites). The Budiansky-Hutchinson-Evans shear-lag model was adopted to analyse the micro-stress field of the damaged composites. The critical matrix strain energy criterion, which presupposes the existence of an ultimate or critical matrix strain energy with matrix, was obtained to simulate the matrix multicracking evolution of CMCs. With the increase of the applied stress, the matrix multicracking and fiber/matrix interface debonding occurred to dissipate the additional energy entered into the composites. The fiber/matrix interface debonded length under matrix multicracking evolution was obtained by treating the interface debonding as a particular crack propagation problem. The conditions for no-debonding and debonding during the evolution of matrix multicracking were discussed in terms of two interfacial properties, i.e., the interface shear stress and interface debonded toughness. When the fiber/matrix interface was bonded, the matrix multicracking evolution was much more intense compared with the interface debonding; when the fiber/matrix interface was debonded, the matrix crack density increased with the increasing of interface shear stress and interface debonded energy. The theoretical results were compared with experimental data of unidirectional SiC/CAS(calcium alumina silicate), SiC/CAS-Ⅱ and SiC/borosilicate composites.      

SIMULATION OF COMPOSITE NON-LINEAR MECHANICAL BEHAVIOR OF CMCS BY FEM-BASED MULTI- SCALE APPROACH

The non-linear behavior of continuous fiber reinforced C/SiC ceramic matrix composites （CMCs） under tensile loading is modeled by three-dimensional representative volume element （RVE） models of the composite. The theoretical background of the multi-scale approach solved by the finite element method （FEM） is recalled first- ly. Then the geometric characters of three kinds of damage mechanisms, i.e. micro matrix cracks, fiber/matrix interface debonding and fiber fracture, are studied. Three kinds of RVE are proposed to model the microstructure of C/SiC with above damage mechanisms respectively. The matrix cracking is modeled by critical matrix strain en- ergy （CMSE） principle while a maximum shear stress criterion is used for modeling fiber/matrix interface debond- ing. The behavior of fiber fracture is modeled by the famous Weibull statistic theory. A numerical example of con- tinuous fiber reinforced C/SiC composite under tensile loading is performed. The results show that the stress/ strain curve predicted by the developed model agrees with experimental data.     

Cf/SiC陶瓷基复合材料发展状况

Ｃｆ／ＳｉＣ陶瓷基复合材料作为高温结构材料,在高性能发动机上具有潜在的应用前景。本文综述了制备Ｃｆ／ＳｉＣ陶瓷基复合材料增强相－－碳纤维的发展;Ｃｆ／ＳｉＣ复合材料的基本制备工艺及性能（包括力学性能、复合材料氧化性能、界面性性质等）;复合材料当前的应用等各方面的发展。最后指出了有待解决的问题和今后努力的方向。     

损伤对平纹编织陶瓷基复合材料梁振动特性影响的试验研究

为研究平纹编织陶瓷基复合材料（CMCs）梁受损伤影响的非线性振动特性,本文分别开展了拉伸试验和振动试验。拉伸试验用于获得平纹编织CMCs受损伤影响的变刚度行为,多次正弦扫频试验用于获得振动载荷下平纹编织CMCs梁受损伤影响的非线性行为。拉伸试验得到的非线性应力-应变曲线表明材料受损伤影响变刚度行为明显。梁初始固有频率的试验值与理论值相比,相对误差小于1%。振动试验结果从两方面表明了损伤对梁振动特性的影响。一是模态参数的变化,固有频率从初始值（256.44Hz）不断减小,阻尼比呈现增大趋势,而共振位移幅值受固有频率和阻尼比的耦合作用发生非线性且非单调变化。固有频率的变化造成位移幅频特性曲线的左移现象。二是位移幅频特性曲线的多峰现象,在多处载荷频率下产生了位移峰值点。本文的试验结果可用于指导平纹编织CMCs结构动力学计算理论模型的建立。     

考虑孔隙的针刺C/SiC复合材料弹性参数计算

基于针刺陶瓷基复合材料试件(CMCs)光学显微照片的微观型貌,并选择恰当的代表体积单元(RVE),建立了针刺陶瓷基复合材料弹性性能预测的单胞模型.考虑了孔隙率对基体和纤维束弹性性能的影响,采用混合率计算出纤维束的弹性常数,然后将纤维束和基体的弹性参数代入到单胞模型中,通过有限元法计算得到复合材料的整体弹性常数.开展了材料拉伸试验和孔隙率测定试验,测得材料的开孔孔隙率为7.33%,闭孔孔隙率为10.67%,弹性性能的计算结果与试验吻合较好,误差为3.1%.      

层合陶瓷基复合材料多尺度应力-应变计算模型

对层合陶瓷基复合材料(CMCs)的应力-应变行为进行了研究。基于多尺度分析方法，实现了由组分性能参数到层合陶瓷基复合材料整体应力-应变的计算。采用可实现单向纤维增强陶瓷基复合材料应力-应变计算的细观力学模型，由材料的细观组分性能计算出单向板的非线性弹性性能，并将单向板的弹性性能作为层合复合材料模型的输入参数，通过有限元法计算层合陶瓷基复合材料的整体应力-应变响应。与试验数据的对比表明:采用该模型可以实现层合陶瓷基复合材料在单调拉伸载荷及拉伸加卸载条件下应力-应变曲线的预测，其中数据的最大偏离为19.61%.      

激光毛化对Cf/SiC与TC4钎焊接头组织及性能的影响

由于线胀系数差异大,Cf/Si C复合材料与TC4钛合金钎焊接头容易形成较大的内应力而开裂失效。为了进一步提高接头强度,应用激光毛化工艺在Cf/Si C表面烧蚀出微孔,采用银基钎料对Cf/Si C与TC4进行钎焊。焊后对接头力学性能进行测试,对接头界面及断口显微组织进行观察。结果表明:焊前对Cf/Si C表面进行激光毛化处理,钎料能够填充微孔并形成良好的钎焊界面,能够提高Cf/Si C与TC4钎焊接头的剪切强度。