薄壁通壳体类零件加工技术

以铝合金薄壁通壳体零件为例,对工件的定位、装夹、刀具的选择、切削参数设置、程序的编制等方面进行了探索,从而有效地克服了薄壁通壳体类零件在加工过程中出现的颤振、变形、表面质量差、尺寸精度低等问题,并大幅缩短了加工时间。     

惯性微系统封装集成技术研究进展

随着微机电系统(Micro Electro Mechanical System,MEMS)的器件圆片级封装技术、垂直互连转接板技术、新键合工艺技术等技术研究的出现,惯性微系统正在朝着三维封装集成架构发展,以满足微电子技术更高集成度、更小体积、更低功耗、更低成本的发展需求。介绍了MEMS惯性器件和MEMS惯性微系统三维集成技术,硅通孔(Through Silicon Via,TSV)三维互连技术和倒装芯片技术为惯性MEMS微系统三维集成一体化提供了设计空间,有效地降低了惯性MEMS三维集成模块的体积、质量,提高了集成度,符合未来惯性MEMS三维集成多功能融合趋势的需求。     

一种改进的高精度硅微陀螺仪闭环驱动方案研究

提出了一种改进的高精度硅微陀螺仪闭环自激驱动方案。该方案对相角进行了优化控制，消除了驱动频率和驱动模态固有频率的相对频差影响，实现了闭环驱动的相角和增益条件的解耦。利用闭环回路中直流控制量与驱动力间的非线性关系，实现闭环自激控制。试验结果表明，1小时内，驱动频率变化的均方差为0．009Hz，相对变化量为2．2ppm；驱动幅度变化的均方差为0．0025mV，相对变化量为15ppm。由此可见，本方案使驱动频率和幅度稳定性得到了极大提高。     

微系统集成用倒装芯片工艺技术的发展及趋势

倒装芯片(Flip Chip,FC）技术是一种应用广泛的集成电路电子封装技术。随着电子产品不断向小型化和多功能化方向升级,尤其是在微系统集成领域飞速发展的驱动下,FC技术也在不断发展以满足细节距和极细节距芯片的封装要求。同时,FC技术也在工业化的过程中追求着性能、成本和封装效率的平衡。将FC封装体分为芯片凸点、基板以及底填充材料三个主要部分,深入讨论了FC封装的主流工艺和新兴工艺,介绍了各个工艺的流程及优缺点。此外,还分析了FC封装体在热、力以及电载荷作用下的可靠性问题。     

面向宇航应用光传输微系统集成技术

为了满足宇航系统对高速、宽带数据和图像传输产品小体积、轻质化的需求，研究光传输高速高密度集成技术。基板采用带状差分线设计和叠层组装工艺，提高集成密度、缩小体积提升了系统组装的空间，并通过建模仿真设计分析高速信号完整性；将光器件设计在外壳底板上，实现高效散热结构设计，同时提高了光器件使用可靠性；采用混合集成微组装工艺，硅转接基板实现芯片级三维立体集成，采用二次封装技术解决了光纤高效耦合与气密共实现的难题。微系统模块体积≤27 mm×24 mm×5 mm，气密封装漏率≤5×10–9Pa·m3/s(He)。     

Metrology on-board PROBA-3: The shadow position sensors subsystem

PROBA-3 is an ESA mission aimed at the demonstration of formation flying performance of two satellites that will form a giant coronagraph in space. The first spacecraft will host a telescope imaging the solar corona in visible light, while the second, the external occulter, will produce an artificial eclipse. This instrument is named ASPIICS (Association of Spacecraft for Polarimetric and Imaging Investigation of the Corona of the Sun). To accomplish the payload's scientific tasks, PROBA-3 will ensure sub-millimeter reciprocal positioning of its two satellites using closed-loop on-board metrology. Several metrology systems will be used and the Shadow Position Sensor (SPS) subsystem senses the penumbra around the instrument aperture and returns the 3-D displacement of the coronagraph satellite, with respect to its nominal position, by running a dedicated algorithm. In this paper, we describe how the SPS works and the choices made to accomplish the mission objectives.     

空间用硅太阳电池带通滤波器的研究

为改善硅太阳电池在轨工作期间的性能,通过对空间用太阳电池带通滤波器结构设计和制备工艺的研究,研制出一种空间用硅太阳电池的带通滤波器并对其性能进行了测试,结果表明,采用该带通滤波器可使硅太阳电池在轨工作温度降低6°C～12°C,输出功率增加1.8%～4.1%.带通滤波器的研制对于促进高效硅太阳电池的空间应用具有积极意义.     

Dispersion-free quantum clock synchronization via fiber link

We proposed a fiber-based quantum clock synchronization protocol by employing the dispersion cancellation feature of the frequency anti-correlated entangled source under the quantum interference measurement. It is shown that, the accuracy of the synchronization is mainly dependent on the bandwidth of the frequency entangled biphoton spectrum and on the temperature variation induced fluctuations in both the reference fiber coiling and the fiber link. With this proposal, synchronization between two clocks at a distance of ten kilometers can be implemented with an accuracy below a picosecond.     

识别大学生心理咨询言语隐藏性的快捷方法--从表情"测谎"

通过表情反映情绪变化的论述，说明了表情可以“测谎”。表情“测谎”又分为面部表情“测谎”，体态表情“测谎”和言语表情“测谎”，它已成为识别大学生心理咨询言语隐藏性的快捷方法。     

Advanced Technologies Demonstrated by the Miniature Integrated Camera and Spectrometer (MICAS) Aboard Deep Space 1

MICAS is an integrated multi-channel instrument that includes an ultraviolet imaging spectrometer (80–185 nm), two high-resolution visible imagers (10–20 μrad/pixel, 400–900 nm), and a short-wavelength infrared imaging spectrometer (1250–2600 nm). The wavelength ranges were chosen to maximize the science data that could be collected using existing semiconductor technologies and avoiding the need for multi-octave spectrometers. It was flown on DS1 to validate technologies derived from the development of PICS (Planetary Imaging Camera Spectrometer). These technologies provided a novel systems approach enabling the miniaturization and integration of four instruments into one entity, spanning a wavelength range from the UV to IR, and from ambient to cryogenic temperatures with optical performance at a fraction of a wavelength. The specific technologies incorporated were: a built-in fly-by sequence; lightweight and ultra-stable, monolithic silicon-carbide construction, which enabled room-temperature alignment for cryogenic (85–140 K) performance, and provided superb optical performance and immunity to thermal distortion; diffraction-limited, shared optics operating from 80 to 2600 nm; advanced detector technologies for the UV, visible and short-wavelength IR; high-performance thermal radiators coupled directly to the short-wave infrared (SWIR) detector optical bench, providing an instrument with a mass less than 10 kg, instrument power less than 10 W, and total instrument cost of less than ten million dollars. The design allows the wavelength range to be extended by at least an octave at the short wavelength end and to ∼50 microns at the long wavelength end. Testing of the completed instrument demonstrated excellent optical performance down to 77 K, which would enable a greatly reduced background for longer wavelength detectors. During the Deep Space 1 Mission, MICAS successfully collected images and spectra for asteroid 9969 Braille, Mars, and comet 19/P Borrelly. The Borrelly encounter was a scientific hallmark providing the first clear, high resolution images and excellent, short-wavelength infrared spectra of the surface of an active comet’s nucleus.