| 航天器上无铅BGA器件焊接工艺研究 |
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| 引用本文： | 徐伟玲,杨晶,李佳宾.航天器上无铅BGA器件焊接工艺研究[J].航天制造技术,2011(5). |
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| 作者姓名： | 徐伟玲 杨晶 李佳宾 |
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| 作者单位： | 北京空间机电研究所; |
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| 摘 要： | 介绍了航天器上无铅BGA器件的应用,重点介绍了无铅BGA器件的三种工艺焊接方法,通过工艺试验分析得出,三种方法都能较好地解决无铅器件的焊接问题。
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| 关 键 词： | 无铅器件 BGA 焊接 可靠性 |
Soldering Process Investigation on Lead Free BGA in Spacecraft |
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| Xu Weiling Yang Jing Li Jiabin.Soldering Process Investigation on Lead Free BGA in Spacecraft[J].Aerospace Manufacturing Technology,2011(5). |
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| Authors: | Xu Weiling Yang Jing Li Jiabin |
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| Institution: | Xu Weiling Yang Jing Li Jiabin(Beijing Institute of Space Mechanics and Electricity,Beijing 100076) |
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| Abstract: | Application of lead free BGA on spacecraft is introduced in this paper.Three soldering methods of lead free BGA are introduced emphatically.All these methods can solve the soldering problems of lead free device through analysis of processing test. |
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| Keywords: | lead free device BGA soldering reliability |
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