| 提高CQFP封装器件加工的工艺可靠性试验 |
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| 引用本文： | 孟宪刚,杨会平.提高CQFP封装器件加工的工艺可靠性试验[J].航天器工程,2006,15(4):64-67. |
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| 作者姓名： | 孟宪刚 杨会平 |
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| 作者单位： | 北京控制工程研究所，北京控制工程研究所 北京 100080，北京 100080 |
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| 摘 要： | CQFP 封装器件已经应用于航天电子产品,但出现了引脚脱焊和断裂等问题。针对此类问题,文章对 CQFP 封装器件焊接、敷形涂覆和粘固进行了工艺研究,并进行了热真空、热循环、振动等可靠性试验进行验证,确定试验中的工艺方法可行、可靠,可以用于航天器的电子产品。
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| 关 键 词： | CQFP 工艺 可靠性 |
Process Reliability Test for CQFP Package Components |
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| MENG Xiangang YANG Huiping.Process Reliability Test for CQFP Package Components[J].Spacecraft Engineering,2006,15(4):64-67. |
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| Authors: | MENG Xiangang YANG Huiping |
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| Abstract: | Although CQFP package components have been applied in electronic equipment of space- craft,they happen to lead rupture in environmental tests.This paper described the process research of CQFP package components in detail including soldering,conformal coating and adhesive sticking.And through the vacuum thermal test,thermal cycling test,sine vibration test and random vibration test, it is proved that the selected process is available,reliable,and can be used in spacecraft. |
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| Keywords: | CQFP process reliability |
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