| 现代印刷电路板技术的现状与发展趋势 |
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| 引用本文： | 麦久翔,许贵银.现代印刷电路板技术的现状与发展趋势[J].上海航天,1995(1):31-36. |
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| 作者姓名： | 麦久翔 许贵银 |
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| 作者单位： | 上海有线电厂，上海电子通讯设备研究所 |
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| 摘 要： | 以列表形式给出历代印刷电路板（ＰＣＢ）的发展概况，介绍现代ＰＣＢ的技术特征，认为ＣＡＤ布线与激光光绘仪制版技术、金属化技术、孔化技术、材料技术和测试技术是发展ＰＣＢ的关键技术，并对这些技术进行了分析。
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| 关 键 词： | 印刷电路板 溅射 印刷电路 |
The Technology Status and Trend for Printed Circuit Board |
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| Mat Jiuxiang.The Technology Status and Trend for Printed Circuit Board[J].Aerospace Shanghai,1995(1):31-36. |
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| Authors: | Mat Jiuxiang |
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| Institution: | Mat Jiuxiang (Shanghai Wire Communication Factory)Xu Guiyin(Shanghai Electronic Communication Equipment institute ) |
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| Abstract: | The Trends for print circuited boards (FCB) is given on the form of list. The technical characteristics of modern PCBs are also introduced. This paper considers that the technologies, such as CAD wiring,plate making by laser draught machine, metallization, emulsification,materials and testing, are key technologies to develop PCBs. These technologies are analyzed in this paper. |
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| Keywords: | PCB technology Sputter Metallization High-density Flexiable PCB |
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