Problem of Circular Hole in Thermopiezoelectric Media with Semi-permeable Thermal Boundary Condition

The semi-permeable boundary condition is proposed to discuss the influence of the thermal conductivity acting on the stress and heat flow around the hole. Based on the Stroh formalism, the closed form solutions are de- rived, the stress and heat flow around the hole are discussed. The results show that the thermal boundary condi- tion has significant influence on the hoop stress and heat flow around the hole. The hoop stress decreases dramatic- ally with the increasement of the thermal conduction coefficient.