复合材料胶粘修复界面的载荷传递仿真优化

胶接修复工艺是飞机结构修理的重要工艺之一,为了研究胶黏工艺对修复效果的影响规律,探索最佳的工艺参数,本文建立胶粘修复的三维模型,利用ANSYS Workbench有限元软件对胶粘修复界面载荷传递进行分析,讨论补片材料、补片厚度、胶层剪切模量和胶层厚度对胶接修复的影响。仿真结果证明补片材料为硼/环氧树脂时,胶粘失效风险最小;补片较厚时,胶接修复效果好,但补片过厚会削弱胶接修复的效果;胶黏剂剪切模量越大越有助于损伤区域的修复,工程应用中建议选用剪切模量较高的胶黏剂;胶层较厚时会增大胶层发生缺陷的概率从而减弱修复效果,建议合理选取厚度较小的胶层。最后提出修复界面的表面处理、复合材料端部的溢胶以及倒角处理均有益于修复结构的载荷传递,缓和胶粘界面应力水平,降低胶层失效的风险。     

基于低温烧结银的航天功率模块基板大面积连接工艺改进

由于传统航空功率模块中大面积基板连接采用锡铅焊料,可靠性不佳,本文采用烧结银进行大面积基板连接,研究了接头的力学性能、断裂模式和显微组织。结果表明:接头力学性能良好,平均剪切强度为45.18 MPa,呈现出内聚失效和韧性断裂模式,粘接层的孔隙率为4.82%,显微结构致密均匀,界面结合良好。改进的大面积烧结银工艺只需印刷一次焊膏,采用快速升温速率提高烧结银致密度,并将烧结压力降至2 MPa,可以满足航天功率模块中基板连接的要求。     

Microstructural formation and mechanical performance of friction stir double-riveting welded Al-Cu joints

A novel friction stir double-riveting welding (FSDRW) technology was proposed in order to realize the high-quality joining of upper aluminum (Al) and lower copper (Cu) plates, and this technology employed a Cu column as a rivet and a specially designed welding tool with a large concave-angle shoulder. The formations, interfacial characteristics, mechanical properties and fracture features of Al/Cu FSDRW joints under different rotational velocities and dwell times were investigated. The results showed that the well-formed FSDRW joint was successfully obtained. The cylindrical Cu column was transformed into a double riveting heads structure with a Cu anchor at the top and an Al anchor at the bottom, thereby providing an excellent mechanical interlocking. The defect-free Cu/Cu interface was formed at the lap interface due to the sufficient metallurgical bonding between the Cu column and the Cu plate, thereby effectively inhibiting the propagation of crack from the intermetallic compound layer at the lap interface between the Al and Cu plates. The tensile shear load of joint was increased first and then decreased when the rotational velocity and dwell time of welding tool increased, and the maximum value was 5.52 kN. The FSDRW joint presented a mixed mode of ductile and brittle fractures.     

Recent advances and trends in roll bonding process and bonding model: A review

This review presents a thorough survey of the roll bonding process with a focus on the bimetallic bars/tubes as well as the bonding models and criteria. The review aims to provide insight into cold, hot and cryogenic bonding mechanisms at the micro and atomic scale and act as a guide for researchers working on roll bonding, other joining processes and bonding simulation. Meanwhile, the shortcomings of roll bonding processes are presented from the aspect of formable shapes, while bonding models are shown from the aspect of calculation time, convergence, interface behavior of dissimilar materials as well as hot bonding status prediction. Two well-accepted numerical methodologies of bonding models, namely the contact algorithm and cohesive zone model (CZM) of bonding models and in simulations of the bonding process are highlighted. Particularly, recent advances and trends in the application of the combination of mechanical interlocking and metallurgical bonding, special energy fields, gradient structure, novel materials, green technology and soft computing method in the roll bonding process are also discussed. The challenges for advancing and prospects of the roll bonding process and bonding model are presented in an attempt to shed some light on the future research direction.     

TC4钛合金扩散焊接头的力学性能

在温度为910℃，压力为3.4MPa条件下对TC4钛合金板材进行了扩散焊接，对获得的扩散焊接头取样进行金相观察，仅在接近接头表面材料深度为1mm范围内发现未焊合缺陷，其余部分焊合较好，表明在给定工艺下可获得质量良好的焊接头.随后对TC4扩散焊接头的力学性能进行了试验研究，分别开展了静拉伸试验、断裂韧性试验及焊缝附近区域的纳米压痕试验.试验结果表明，所制得的TC4扩散焊接头屈服强度为887MPa，抗拉强度为948MPa，断裂韧性为101.9MPa·m1/2，均与原材料的性能相差不大.纳米压痕试验的结果显示，接头焊缝区和母材区的显微弹性模量分别为180.2GPa和178.0GPa.      

Hot deformation behavior and strain compensation constitutive model of equiaxed fine grain diffusion-welded micro-duplex TC4 titanium alloy

In this work, two-stage diffusion bonding of micro-duplex TC4 titanium alloy was carried out to study the flow behavior and constitutive models of the bonding joint and the base metal after the same thermal cycling during the hot forming process. Microstructure and mechanical properties test were used to verify the good quality of the equiaxed fine grain diffusion-welded TC4 alloy. Quasi-static tensile experiment was carried out at temperatures ranging from 750–900 °C and strain rates of 0.0001–0.1 s⁻¹. The joint showed the weak dynamic recovery at strain rates of 0.01–0.1 s⁻¹ and temperatures of 750–850 °C. At strain rates of 0.0001–0.001 s⁻¹ and temperatures of 850–900 °C, the flow stress of joint presented steady-state characteristics. Different deformation conditions lead to the remarkable difference of dynamic softening performance between the joint and heat-treated base metal, but the flow stress in elastic and strain hardening stages exhibited similar behavior. The strain compensated Arrhenius-type constitutive models of TC4 joint and heat-treated base metal were developed respectively. The fifth-order polynomial functions between the material property correlation coefficients and strain were obtained. The models have shown good correlation, with correlation coefficient values of 0.984 and 0.99. The percentage average absolute relative error for the models were found to be 10% and 9.46%, respectively.     

机场道面浅层高早强快速修补砂浆的性能研究

在满足繁忙机场不停航施工要求下,制备出道面浅层高早强快速修补砂浆对保障飞机准点运行及安全起降具有重要意义。采用自制的特种胶凝材料,通过优选砂胶比、水胶比及外加剂复配等技术制备出高早强快速修补砂浆,研究该修补砂浆的力学性能、黏结性能与耐久性能。结果表明:高早强快速修补砂浆2h抗压、抗折强度分别为32.5MPa和4.8MPa,且2h和28d黏结强度可分别达到其抗折强度的75%和84%;与C40混凝土相比,该修补砂浆早期具有微膨胀性,可补偿收缩,减小与旧混凝土间变形差异,120d收缩率降低了60.5%,3d耐磨性可达到C40混凝土28d的耐磨性,且具有优良的抗渗性与抗冲击性。     

DP590高强钢双脉冲胶焊连接工艺研究及数值模拟

针对DP590高强钢,设计了一种双脉冲直流点焊波形,开展胶焊工艺试验研究,对比分析单脉冲胶焊与双脉冲胶焊接头的力学性能;建立胶焊仿真模型,分析双脉冲胶焊温度场的演变规律。结果表明:双脉冲电流的引入能有效降低飞溅的产生,提高接头质量的稳定性,其接头的力学性能优于单脉冲胶焊;其次,双脉冲胶焊工艺熔核区存在两次焊核增长过程,热循环曲线呈现"双峰"特征,且热输入量高于单脉冲胶焊;双脉冲胶焊接头焊核直径的模拟值和实际值均大于单脉冲胶焊接头,仿真的焊核直径分别为6.42、5.97 mm,对应的实际焊核直径分别为6.61、5.77 mm。