Study of the 2013 Lushan M7.0 earthquake coseismic ionospheric disturbances

On April 20, 2013, an earthquake of M7.0 occurred in Lushan, Sichuan province, China. This paper investigates the coseismic ionospheric anomalies using GPS (Global Positioning System) data from 23 reference stations in Sichuan province that are a part of the Crustal Movement Observation Network of China (CMONOC). The recorded results show that a clear ionospheric anomaly occurred within 15 min after the earthquake near the epicenter, and the occurrence time of the anomalies recorded by various stations is related to the distance from the epicenter. The maximum anomaly is 0.25 TECu, with a 2 min duration and the distance of the recording station to the epicenter is 83 km. Acoustic waves generated by the crustal vertical movement during the earthquake propagate up to the height of the ionosphere lead to the ionospheric anomaly, and the propagation speed of the acoustic wave is calculated as 0.72 ± 0.04 km/s based on the propagation time and propagation distance, consistent with the average speed of sound waves within a 0–450 km atmospheric height.     

锥筒型喷管内壁化学铣切工艺优化

锥筒型喷管内壁化学铣切后同一产品不同部位化铣槽深尺寸散差较大,且不同批次产品铣切后槽深尺寸散差波动也较大,对装配后产品稳定性造成了一定影响。分析认为:由于锥筒型喷管内壁零件的特殊性,化学铣切时零件不同部位溶液的扩散能力不同,导致不同部位铣切速率差异较大,最终不同部位铣槽深度散差较大。根据零件结构特点,设计出新型化学铣切转动装置,该装置实现了零件双向组合旋转,显著降低了零件不同部位溶液扩散差异性,提高了产品化学铣切槽深度尺寸均匀性。此外,研究了1Cr18Ni9Ti材料零件化学铣切时,杂质离子对铣切稳定性的影响,并确定了极限浓度,建立了杂质含量与零件铣切数量的对应关系,以此监测溶液质量,提高了化学铣切稳定性。     

T700/PEEK热塑性自动铺放预浸纱制备质量控制及性能研究

为满足高性能热塑性复合材料自动铺丝（AFP）成型工艺的原材料需求,研究了粉末悬浮法浸渍制备T700/PEEK预浸纱关键工艺参数及预浸料性能,分析聚醚醚酮PEEK浸渍连续碳纤维过程中不同工艺参数（悬浊液浓度、超声功率、张力、牵引速率、浸渍温度、辊压温度及压辊间隙）对预浸纱质量的影响规律,利用扫描电子显微镜（SEM）观察T700/PEEK预浸纱内部孔隙率及界面结合状态,将粉末悬浮法制备的T700/PEEK预浸纱模压制备了热塑性复合材料单向层合板试样,并测试了其热塑性复合材料层间剪切强度和拉伸强度。研究结果表明：预浸纱含胶量与粉末悬浮液浓度变化线性正相关,且随超声功率的增大而升高;浸渍过程中伴随温度的升高以及牵引速率的减小,预浸纱宽度变小、孔隙率降低,随着张力的增大,预浸纱宽度增大、孔隙率降低;辊压成型过程中随着温度的提高以及压辊间隙的减小,预浸纱宽度增大、孔隙率降低。综合考虑各工艺参数的影响规律,获得优化的热塑性预浸纱制备工艺参数：浸渍温度为360~370℃,辊压温度为330℃,压辊间隙为0.1 mm,牵引速率为15~20 mm/s,张力为7 N。扫描电镜结果显示树脂与纤维界面结合紧密,复合材料的孔隙率可降低至1.8%,复合材料层间剪切强度为73.43 MPa,纵向拉伸强度达1.71 GPa。     

快速高稳定化学镀镍磷工艺

在合理选择化学镀镍体系的前提下,研究了各工艺组成及参数对镀速和镀层磷含量的影响。成功地获得快速高稳定化镀镍工艺。采用本工艺可获得含磷１０％－１２％的化学镀镍层,镀速达２０－２４μｍ／ｈ,具有很好的推广应用前景。     

硼含量及横向取样对定向凝固Ni_3Al合金持久性能的影响

硼的添加增强了晶界的结合力 ,使合金相界面的位错组态改变 ,提高了持久断裂寿命 ;硼的添加细化晶粒 ,增加界面数 ,使持久寿命下降。Ni3Al定向凝固横向试样持久性能不稳定与取样位置有关     

新乡上空电离层总电子含量的经验模式

基于电离层总电子含量与太阳活动性之间的线性相关关系,利用在新乡长期测量所得的电离层总电子含量的资料,得出了总电子含量的一种经验模式。      

近红外漫反射光谱技术在预浸布质量指标在线测定中的应用

采用近红外漫反射光谱技术对高硅氧/酚醛预浸布的树脂含量、挥发分含量和预固化度等质量指标进行了在线测定。利用偏最小二乘法所建立的树脂含量、挥发分含量和预固化度模型的决定系数R2分别为99.20、99.14和99.11,交叉验证均方差RMSECV分别为0.298、0.144和0.124。利用外部验证集,对模型进行t-检验,在给定显著性水平0.05的情况下,近红外的测定结果和标准方法的测定结果对比,两者不存在显著性差异。该方法在预浸布生产线的应用,为其生产过程中的质量控制提供了一种有效的分析手段。     

多芯片组件（MCM）用金锡焊带材料电阻率及热导率温度特性研究

对牌号为Au₈₀Sn₂₀的金锡焊带材料在208~423 K的电阻率及热导率与温度的函数关系进行了研究，并对其在多芯片组件（MCM）中的传热效果进行了评估。分别对材料在208~423 K中5个温度点的电阻率及4个温度点的热导率进行了测试，基于理论模型建立电阻率/热导率随温度变化的函数关系，最终采用模拟热扩散数值方法评估材料在高温下的传热能力。结果表明，采用修正函数模型后，金锡焊带材料在208~423 K下热导率与电阻率的关系符合测试结果，随芯片表面温度的边界条件从208 K升高至423 K，采用变温热导率模型得到的热流密度模拟计算结果相比理想化恒定热导率模型的差异性逐渐升高至5.5%。综上，金锡焊带材料热导率与电阻率的关系符合Wiedemann-Franz法则修正后的Smith-Palmer方程，在该材料传热设计时应考虑其热导率温度效应。     

Negative VTEC with spherical harmonic expansion model under different solar activity conditions

The Earth’s ionosphere can be described by a spherical harmonic (SH) expansion up to a specific degree. However, there exist negative vertical total electron content (VTEC) values in the global ionosphere map (GIM) with the SH expansion model. In this contribution, we specifically investigated the negative VTEC values that are induced by the SH expansion model and validated the performance of the inequality-constrained least squares (ICLS) method in eliminating the negative VTEC values. The GPS data from 2004 to 2017 was selected to cover one solar cycle and the experiments under different solar activity conditions were analyzed. The results in our work show that the occurrence of the negative VTEC values is attributed to the deficiency of the SH expansion model when the VTEC itself is small instead of the unevenly distribution of the GNSS stations. The negative VTEC values appear periodically in the temporal domain, showing apparently one year and half year periods. During one year, two peaks in June and December can be observed in the time series of the negative VTEC values. The number of negative VTEC values in June is obvious larger than that in December. During one solar cycle, the number of negative VTEC values under quiet solar activity condition is obvious larger than that under strong solar activity condition. In the spatial domain, the appearance of the negative VTEC values is strongly related with the movement of the subsolar point. In the latitude of the subsolar point has the largest magnitude, the negative values will appear on the opposite hemisphere and the further from the subsolar point the more negative values. The maximum number of the negative VTEC values in the southern hemisphere appears in June, while the peak value in the northern hemisphere appears in December. The maximum number of negative VTEC values in the southern hemisphere is generally larger than that in the northern hemisphere. In addition, the negative VTEC values are distributed both at middle latitude and high latitude in the southern hemisphere, while they are mainly distributed at high latitude in the northern hemisphere. When the ICLS method is used, the negative VTEC values can be eliminated efficiently and it has nearly no influence on the positive VTEC values. The ICLS method can also improve the receiver’s differential code bias (DCB) and significantly decrease the unreasonable negative slant TEC (STEC) values along the lines of sight. Using the final GIM product of the Jet Propulsion Laboratory (JPLG) as a reference, the root mean square (RMS) of the ICLS solution shows maximum 25%, 20% and 45% improvement relative to the least squares (LS) solution at northern high latitude, southern middle latitude and southern high latitude, respectively.     

电子产品中铅焊接金脆问题浅析

针对航天电子产品广泛采用的Sn-Pb焊料在镀金表面焊接形成焊点的工艺,分析了工业及国内外航天相关标准文件中对焊接后焊点中含金量的要求以及焊点含金量、时效、器件不同封装形式对焊点可靠性的影响,并深入分析了合金焊点金相组织结构,最后介绍了一般去金工艺要求与去金不到位而导致器件失效案例。