Z-pin 点阵分布对层合板面内压缩性能的影响简

 Z-pin三维增强技术能显著提高层合板层间性能,但会一定程度上引起层合板面内性能劣化。本文着重研究Z-pin植入点阵分布对层合板的面内性能的影响,设计加工了在层合板中植入一定体积分数不同点阵分布的Z-pin增强层合板试样,并进行了面内压缩性能测试,获得了Z-pin的点阵分布对层合板面内压缩强度的影响规律,并利用有限元软件分析了Z-pin点阵分布对面内压缩强度的影响机制。研究表明,Z-pin的植入降低面内压缩强度的原因是其破坏了层合板中的部分承载纤维,层合板的压缩强度与垂直于加载方向截面上的Z-pin分布数量成反比;在层间增强要求允许条件下,Z-pin应尽量平行于面内载荷的承载方向植入。     

Z-pin增强复合材料开孔层合板压缩性能

针对复合材料开孔层合板孔边应力集中而导致承载能力降低现象,采用Z-pin增强技术提高性能。重点了研究开孔层合板的压缩性能,制备了不同Z-pin植入体积分数的开孔层合板试样并进行了压缩试验,在试验基础上,应用有限元分析方法对Z-pin增强开孔层合板进行建模分析,基于渐进损伤分析法和内聚单元法模拟了复合材料基体以及Z-pin的增强效果。试验结果表明:Z-pin的植入可以显著提高开孔层合板的抗压性能,且随着Z-pin植入体积分数的提高,压缩性能不断上升,压缩强度最高可以提高23.06%;只有沿载荷方向,位于开孔两侧的Z-pin可以提高结构的承载能力;在Z-pin桥联力的作用下,降低了损伤的扩展速度,但并没有改变层合板的最终失效模式。模拟结果表明:压缩损伤从孔边向两侧扩展,位于层合板中心的铺层最先出现损伤,其中第6层与第10层的增强单元最先发生破坏。模拟计算结果与试验结果得到了较好的吻合,该有限元模型对于Z-pin增强复合材料开孔层合板的适用性得到了验证。      

Z-pin增强复合材料层合板拉伸性能的试验研究及模拟分析

针对Z-pin增强复合材料层合板的拉伸性能进行了试验研究及模拟分析.拉伸试验研究了3种铺层方式的层合板:[0]6;[90]12;[45/0/-45/90]2S.模拟分析将根据引入Z-pin造成的复合材料层合板微观结构变化建立单胞模型来进行,通过调整单元材料坐标系的1方向来模拟Z-pin周边纤维偏转.通过试验研究和模拟分析得出了Z-pin对3种层合板拉伸强度的影响程度.研究表明Z-pin引入造成的面内纤维含量降低(由树脂富裕区引起)和纤维方向偏转(包括纤维面内偏转和厚度方向卷曲)是层合板拉伸性能降低的主要原因.通过模拟分析进一步得出:对于[0]6铺层层合板,Z-pin插入引起的纤维面内偏转是面内拉伸强度降低的主要因素;对于准各向同性层合板,Z-pin插入产生的树脂富裕区(降低了纤维含量)是面内拉伸强度降低的主要因素.     

层合复合材料Z-pin增强技术研究进展

纤维增强复合材料层合板具有良好的面内力学性能和可设计性,但较低的层间强度和层间断裂韧性影响了其工程应用.应用各种Z向增强技术(包括缝合技术、三维编织、Z-pin增强技术等)提高层合复合材料抗分层性能是航空复合材料结构技术的重要研究内容.     

Z-pin植入密度对复合材料壁板力学性能影响的研究

针对植入Z-pin后的碳纤维增强平纹机织复合材料的微观结构,建立了含Z-pin的机织复合材料单层板和层合板的单胞模型。预报了Z-pin直径、面内分布密对单层板的面内纵向拉伸力学性能的影响,得出了含有Z-pin的机织复合材料单胞在受面内拉伸时,会在Z-pin附近出现应力集中,单胞首先会在应力集中区域发生失效而导致强度降低。通过三维单胞模型模拟了Z-pin在层合板中拉出脱离过程,得出了不同Z-pin直径、不同分离层厚度下的拉拔力—位移曲线。建立了用非线性弹簧模拟Z-pin的双悬臂梁模型,结合VCCT裂纹扩展技术,模拟了含有Z-pin复合材料层合板的Ⅰ型裂纹扩展,得出了Z-pin直径越大,分布越密,层合板的等效Ⅰ型应变能量释放率GIC越大,且直径越大使GIC随裂纹扩展的波动幅度越大,分布越密使GIC波动的波长越小。     

Z-pin增强树脂基复合材料单搭接接头抗冲击性能

为了研究Z-pin增强树脂基复合材料接头的抗冲击性能,制备了Z-pin增强单搭接接头冲击试样。对比不同树脂体系Z-pin/层合板界面裂纹扩展,分别通过Z-pin拔脱试验和接头剪切试验研究Z-pin冲击后拔脱强度和单搭接接头冲击后剪切强度;结合有限元模拟和超声C扫描研究搭接面分层损伤情况。结果表明,相同冲击能量下,环氧Z-pin/环氧层合板界面抗冲击性更强,冲击能量越大,裂纹扩展越显著;Z-pin增强树脂基复合材料显著减小分层损伤面积,提高冲击后剪切强度,体积分数为1.5%、直径为0.5mm的Z-pin增强层合板分层损伤面积仅为40%,冲击后剪切强度的下降率仅为24.89%。随着Z-pin体积分数增加,搭接面损伤面积逐渐减小,冲击后剪切强度先增加后降低;随着Z-pin直径增加,层间损伤面积增加,冲击后剪切强度逐渐降低。Z-pin增强接头分层损伤模型模拟结果与试验结果基本吻合。      

湿热环境下K-cor夹层复合材料的力学性能

K-cor夹层结构是应用Z-pin技术增强的一种新型高性能夹层结构,本文研究了Z-pin不同植入密度对K-cor夹层结构试样吸湿特性的影响规律,在此基础上对不同Z-pin植入参数对试样湿热前后三点弯曲性能和压缩性能的影响规律进行了深入研究。研究结果表明：夹层结构中Z-pin的植入能提高试样的尺寸稳定性,且不会对其吸湿率造成明显影响;Z-pin植入密度的增加能明显提高湿热前后试样三点弯曲强度和压缩强度,且具有较高的强度保持率,Z-pin密度为12 mm×12 mm的K-cor夹层结构湿热处理试样的三点弯曲强度比未湿热处理空白试样的要高11.1%,8 mm×8 mm湿热处理K-cor试样的芯部压缩强度比未湿热处理空白夹层结构试样要高17.5%,体现出K-cor夹层结构优异的抗湿热性能;而Z-pin植入角度的减小能明显提高试样湿热处理前后的压缩强度,0°植入K-cor试样湿热处理后的芯部压缩强度与40°植入K-cor试样未湿热处理的基本相同,但植入角度对三点弯曲强度影响较小。     

含分层缺陷复合材料层合板压缩强度试验研究

复合材料层合结构在生产和使用过程中经常会出现分层损伤,为研究分层损伤对复合材料层合结构压缩强度的影响,对含预制分层缺陷的复合材料层合板进行了静强度压缩试验研究,主要研究了沿层合板厚度方向2种不同位置的分层缺陷对复合材料层合板压缩强度的影响.试验结果表明:2类试验件断裂位置均主要集中在预制分层缺陷的边缘,断裂部位呈现不同程度的分层扩展;2类试验件的压缩强度较无初始缺陷的试验件分别降低9.04％和8.60％,说明分层缺陷的位置对复合材料层合板压缩强度的影响程度略有不同,分层缺陷位于层合板厚度方向中间位置时对压缩强度影响较大.     

Z-pin植入参数对X-Cor夹层复合材料力学性能的影响

 X-Cor夹层复合材料是一种新型的Z-pin增强泡沫夹层结构,具有突出的比强度、比刚度。采用热压成型工艺,在不同的Z-pin植入参数下制备了X-Cor夹层复合材料,并对这种结构材料的平压和剪切力学性能进行了研究,考察了植入角度、植入密度、植入方向等参数的影响规律。结果表明,Z-pin植入参数对X-Cor夹层复合材料的平压性能和剪切性能影响显著。X-Cor夹层复合材料平压性能随Z pin植入角度和植入密度的增大而增加,植入角度达到90°时,X-Cor夹层复合材料平压强度及模量最大;剪切性能随Z-pin植入角度的增大而减小,实验范围内,植入角度为45°时,剪切强度和模量最大;同时,X桁架的植入方向对剪切性能也有很大影响,相同Z-pin植入密度下,沿试样长度方向植入的X桁架含量增加时,夹层复合材料的剪切模量增加;X-Cor夹层复合材料的平压性能和剪切性能随Z-pin植入角度的变化规律相反,Z-pin植入角度在60°~70°之间时,X-Cor夹层复合材料平压性能与剪切性能均达到较高值。     

Z-pin增强复合材料帽型单加筋板弯曲性能

针对复合材料帽型加筋壁板结构弯曲承载性能差的缺点,采用Z-pin增强技术提高弯曲承载性能。为研究Z-pin直径、体积分数、增强区长度对复合材料帽型加筋壁板弯曲性能的影响,制备了不同参数的Z-pin增强帽型加筋壁板试样并开展三点弯曲试验,对Z-pin增强机理及试样失效机制进行了分析。结果表明：随着体积分数的增加,由于Z-pin的桥联作用,Z-pin增强帽型加筋壁板弯曲性能提高,同时由于Z-pin植入产生的损伤增加,通过理论分析得到当Z-pin体积分数为2.6%时,弯曲峰值力达到最大值6.1 kN;Z-pin直径对帽型加筋壁板弯曲峰值力影响不显著;当Z-pin增强区长度为总长度的48%时,Z-pin增强帽型加筋壁板弯曲峰值力与全部植入Z-pin时基本相当。     

Improving Mode II delamination resistance of curved CFRP laminates by a Pre-Hole Z-pinning (PHZ) process

This paper presents an experimental investigation of the Mode II delamination resistance of curved CFRP laminates reinforced with Z-pins. A Pre-Hole Z-pinning (PHZ) process is developed to reduce the in-plane damage of the Z-pinned laminates. The microstructural observation of the Z-pinned laminate specimens indicates that the PHZ process can effectively decrease the defects including the Z-pin offset angle and the area of eyelet zone. The influences of the volume fraction and diameter of Z-pin on the fracture toughness and the delamination crack growth rate of the specimens under End Notch Flexure (ENF) loading are then determined experimentally. The test results show that Z-pin increases the interlayer stiffness of the laminate. The delamination crack growth rate is reduced with the increase of Z-pin diameter and volume fraction, and a reduction up to 40% is achieved compared with the specimens without pins. Furthermore, the Mode II fracture toughness is significantly improved with the increase of Z-pin volume fraction. When Z-pin volume fraction increases by 1%, the achieved fracture toughness is about 200% higher compared to the unpinned laminates.     

Study on Compressive Properties of Z-pinned Laminates in RTD and Hygrothermal Environment

Compressive tests of [0] 12 and [90] 12 unidirectional laminates and [45/0/-45/90] 2S quasi-isotropic laminates are accomplished in both room-temperature and dry (RTD) and hygrothermal environment. And simulation studies on the compressive strength of Z-pinned laminates of [0] 12 and [45/0/-45/90] 2S are conducted by using finite element analysis (FEA). A microstructural unit cell for FEA is created to simulate a representative laminates unit with one pin. Within the unit cell, the first directions of the elements’ material coordinate systems are changed to simulate the fibres’ deflecting around the pin. The hygrothermal effect is simulated by the material properties’ adjustments which are determined by the compressive tests of non-pined laminates. The experimental results indicate that the percentage of reduction in the compressive modulus of Z-pinned laminates caused by Z-pin becomes smaller with the percentage of 0° fibres decreasing in the laminates; the compressive strength of quasi-isotropic laminates reduces and the percentage of the reduction in the compressive strength declines with Z-pin volume content increasing, and the moisture absorption ratio of the Z-pinned specimens is greater than that of the non-pinned specimens, because the cracks around Z-pin increase the moisture absorption. In addition, the simulations show that the deflection of fibres around Z-pin is the main factor for the reduction in the compressive strength of Z-pinned unidirectional laminates, the dilution of fibre volume content caused by resin-rich pocket is the principal factor for the decline in the compressive strength of Z-pinned quasi-istropic laminates, and the compressive strength of Z-pinned specimens in hygrothermal environment reduces as the result of superimposition of some factors, including the changes in material properties caused by hygrothermal environment, the deflection of fibres and the resin-rich pocket caused by Z-pin.     

X-cor夹层复合材料平压性能分析

 X-cor夹层复合材料是一种采用X形Z-pin增强的新型泡沫夹层结构,在航空航天领域有着广阔的应用前景。本文对其平压模量和强度进行了理论预测和实验验证。通过分析其三维单胞力学模型,得到了X-cor夹层复合材料等效平压模量的解析式。采用Winkler弹性地基梁理论解释了泡沫芯材与Z-pin的协同增强效应,并导出了X-cor平压强度的预测公式。以碳纤维/环氧树脂制备的Z-pin分别植入PU,PMI泡沫制得X-cor夹层复合材料,通过力学实验考察了Z-pin参数以及泡沫性能等对X-cor夹层结构平压性能的影响,对理论分析进行了验证。结果证明增大Z-pin的植入角度、体积分数、直径、端部约束或采用高性能泡沫芯材均能提高X-cor平压性能,但增大长度,Z-pin容易失稳,平压强度降低。     

Study on an automatic multi-pin insertion system for preparing Z-pin composite laminates

As a three-dimensional layer enhancement technology, the Z-pin technology is suitable for manufacturing composite prepreg laminates and can also effectively improve their interlaminar properties. In order to manufacture Z-pin composite parts efficiently, this paper proposes a transi- tional insertion system, and according to the technical requirements of the transitional insertion process and the functional requirements of the transitional insertion platform, proposes a transition insertion plan which can insert multiple Z-pins into a carrier. A prototype machine has been designed and made, and a series of function debugging and verification experiments have been car- ried out on the machine. Some problems show up during the experiments, but based on the analysis of the reasons, this paper provides lots of solutions, and finally demonstrates the feasibility and practical value of the system. The results show that the system meets all technical requirements of the Z-pin insertion process. It is capable to insert multiple Z-pins into a foam carrier; as a result, the system is as much as 5 times more efficient than existing equipment, and the deviation for the insertion distance can be controlled within 0.3 mm. This Z-pin transitional insertion platform pro- motes the use of Z-pins in national defense and lays the foundation for commercializing the Z-pin technology.     

Z-pin增强树脂基复合材料单搭接连接性能

为提高复合材料单搭接头的连接性能,制备了不同参数的Z-pin增强单搭接头,通过拉伸试验,研究了Z-pin体积分数、直径以及植入角度对单搭接头连接性能的影响规律,分析了Z-pin对单搭接头性能的增强机理。结果表明Z-pin能明显提高复合材料单搭接头的连接性能：植入角度为90°、Z-pin直径为0.5 mm时,在0%~3.0%体积分数范围内,单搭接头强度随着Z-pin体积分数的增加呈线性增加,含3.0% Z-pin的接头剪切强度为16.76 MPa,比无Z-pin的接头强度提高了33.2%;Z-pin体积分数为1.5%、植入角度为90°时,Z-pin直径变化对单搭接头强度影响不大;含Z-pin体积分数为1.5%、直径为0.5 mm时,随着Z-pin植入角度（背离搭接末端）的增加,单搭接头强度先增加后下降,失效模式从Z-pin拔出失效转变为Z-pin剪断失效;在植入角度为40°时,剪切强度最大（21.04 MPa）,比无Z-pin的接头剪切强度提高了67.1%。Z-pin植入角度（倾向于搭接末端）对单搭接头强度无影响。