共查询到18条相似文献,搜索用时 44 毫秒
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王艳芳 《航空精密制造技术》2010,46(3)
针对Ti/Cu接触反应界面层组织形貌以及生成成分与相进行研究.以Cu/Ti/Cu嵌入式整体结构试验件为试验对象,在连接温度为90℃,连接时间分别为3、5、7、10、12min的条件下进行瞬间液相扩散连接,研究接触熔化过程中,Ti/Cu扩散偶界面微观组织形貌的演变过程、界面成分变化以及相生成的规律. 相似文献
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王艳芳 《航空精密制造技术》2009,45(1)
针对Ti/Cu接触反应界面层的形貌以及液相层的出现和生长规律进行研究.以Cu/Ti/Cu嵌入式整体结构试验件为试验对象,研究接触熔化过程中,Ti/Cu扩散偶界面微观组织形貌的演变过程、界面反应层的出现以及生长规律. 相似文献
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TiAl合金与42CrMo扩散钎焊的界面组织及形成机理 总被引:3,自引:1,他引:3
使用真空扩散钎焊方法对870℃下TiAl/B-Ag72Cu/42CrMo进行了连接,利用金相显微镜、扫描电镜、电子探针成分线分析及成分定量分析等方法研究了TiAl/B-Ag72Cu/42CrMo扩散钎焊接头组织及接头反应层的形成机理.界面分析显示,B-Ag72Cu/42CrMo的界面未形成金属间化合物,而TiAl/B-Ag72Cu的界面上有Ti(Cu,Al)2金属间化合物产生.分析了连接接头金属间化合物的形成和长大机制,钎焊接头金属间化合物的形成和长大机制,分为等温凝固和冷却凝固两个阶段.元素的扩散是控制接头形成的主要因素.连接界面金属间化合物的形成和长大主要有钎料的熔化、沿晶界优先扩散、等温凝固、柱状和蘑菇状长大及纵向长大几个过程. 相似文献
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建立了用于模拟Al-4.7% Cu(质量分数)单相固溶体合金凝固过程温度场、流场、溶质场以及微观组织模拟的元胞自动机-格子玻尔兹曼方法(CA-LBM)数值模型,分析对流作用下枝晶生长的形貌与成分变化.模型处理溶质场计算中固液(S/L)界面处溶质的分配过程,使浓度场的变化和实际的传输过程更加相符.计算结果表明,与不计入流动过程的纯扩散型合金凝固过程相比较,对流对合金枝晶形貌的影响显著,呈现非对称生长形貌.在强制对流条件下,枝晶晶粒大小呈均匀化趋势,枝晶间的局部区域的成分更加均匀,在整体凝固区域内的成分呈现出上游到下游的一定的梯度化趋势. 相似文献
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采用AgCuTi活性钎料,在880℃/10min规范下成功实现了SiO2f/SiO2自身、SiO2f/SiO2与Cu和SiO2f/SiO2与1Cr18Ni9Ti三种接头的连接。实验结果表明,三种接头中靠近SiO2f/SiO2母材的界面处均形成了一层薄薄的扩散反应层组织,反应层中出现了Ti和O的富集,根据两者的原子比例推断生成了TiO2相;另外,三种接头中心区都形成了由灰色相和白色相共同组成的Ag-Cu共晶组织,其中灰色相为Cu基固溶体,白色相为Ag基固溶体。接头剪切强度结果显示,SiO2f/SiO2/Cu接头剪切强度为12.4MPa,SiO2f/SiO2/1Cr18Ni9Ti接头剪切强度为18.4MPa,接头中的残余应力是决定接头强度大小的重要因素之一。 相似文献
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用Ti/Cu/Ni中间层二次部分瞬间液相连接Si3N4陶瓷的研究 总被引:1,自引:0,他引:1
采用Ti/Cu/Ni中间层对Si3N4陶瓷进行二次PTLP连接,研究Ti箔厚度、连接工艺参数对Si3N4/Ti/C/Ni连接强度和界面结构的影响.结果表明Ti箔厚度对连接强度的影响是通过对反应层厚度的影响体现的;在本文试验条件下,改变二次连接工艺参数对Si3N4/Ti/Cu/Ni二次PTLP连接界面反应层厚度无明显影响,其对室温强度的影响是由于连接接头残余应力的变化所导致的;Si3N4/Ti/Cu/Ni二次PTLP连接界面微观结构为Si3N4/反应层/Cu-Ni固溶体层(少量的Cu-Ni-Ti)/Ni. 相似文献
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王铁军%秦思贵%熊宁%林同伟 《宇航材料工艺》2007,37(2):62-65
采用粉末冶金熔体自浸渗工艺制备了相对密度大于98%的TiC/Cu复合材料,并对其耐烧蚀与耐热震性能进行了研究。TiC/Cu复合材料在等离子烧蚀过程中产生了“发汗冷却”效果,随着复合材料中Cu含量的提高,TiC/Cu的弯曲强度与耐热震性能显著提高。TiC陶瓷骨架相对密度为72%的TiC/Cu复合材料的弯曲强度达到955 MPa,较热压纯TiC陶瓷材料有大幅度的提高。 相似文献
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GAO Jian-xin XU Xiao-feng SONG Ke-xing LI Pei-quan GUO Xiu-hua LIU Rui-hua 《中国航空学报》2006,19(B12):36-40
Alumina dispersion strengthened copper composite (nano-Al2O3/Cu composite) was recently emerged as a kind of potentially viable and attractive engineering material for applications requiring high strength, high thermal and electrical conductivities and resistance to softening at elevated temperatures. The nano-Al2O3/Cu composite was produced by internal oxidation. The microstructures of the composite were analyzed by the TEM and its hot deformation behavior was investigated by means of continuous compression tests performed on a Gleeble 1500 thermo-simulator. Making use of the modified algorithm-Levenberg-Marquardt (L-M) algorithm BP neural network, a model for predicting the flow stresses during hot deformation was set up on the base of the experimental data. Results show that the microstructures of the composite are characterized by uniform distribution of nano-Al2O3 particles in Cu-matrix. The sliding of dislocations is the main deformation mechanism. The dynamic recovery is the main softening mode with the flow stress decreasing gently from 500℃ to 850 ~C. The recrystallization of Cu-matrix can be retarded late into as high as 850 ℃, when it happens only partially. The well-trained BP neural network model can accurately describe the influence of the temperature, strain rate, and true strain on the flow stresses, therefore, it can precisely predict the flow stresses of the composite under given deforming conditions and provide a new way to optimize hot deforming process parameters. 相似文献
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GAO Jian-xina XU Xiao-fenga SONG Ke-xinga * LI Pei-quanb GUO Xiu-huaa LIU Rui-huaa aSchool of Materials Science Engineering Henan University of Science Technology Luoyang China bJiang Yin Xing Cheng Special Steel Works CO. LTD Jiangyin China 《中国航空学报》2006,19(Z1)
Alumina dispersion strengthened copper composite (nano-Al2O3/Cu composite) was recently emerged as a kind of potentially vi-able and attractive engineering material for applications requiring high strength, high thermal and electrical conductivities and resistance to softening at elevated temperatures. The nano-Al2O3/Cu composite was produced by internal oxidation. The microstructures of the composite were analyzed by the TEM and its hot deformation behavior was investigated by means of continuous compression tests per-formed on a Gleeble 1500 thermo-simulator. Making use of the modified algorithm–Levenberg-Marquardt (L-M) algorithm BP neural network, a model for predicting the flow stresses during hot deformation was set up on the base of the experimental data. Results show that the microstructures of the composite are characterized by uniform distribution of nano-Al2O3 particles in Cu-matrix. The sliding of dislocations is the main deformation mechanism. The dynamic recovery is the main softening mode with the flow stress decreasing gen-tly from 500 ℃ to 850 ℃. The recrystallization of Cu-matrix can be retarded late into as high as 850 ℃, when it happens only partially. The well-trained BP neural network model can accurately describe the influence of the temperature, strain rate, and true strain on the flow stresses, therefore, it can precisely predict the flow stresses of the composite under given deforming conditions and provide a new way to optimize hot deforming process parameters. 相似文献
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采用Zn-14.1Al-0.9Si和Zn-21.5Al-1.5Si两种钎料钎焊获得铜/铝接头,研究了Cu/Zn-Al-Si/Al接头Cu母材/钎缝界面结构、钎缝中心区显微组织、接头抗剪切性能和断口形貌.研究发现,Cu/Zn-14.1Al-0.9Si/Al接头和Cu/Zn-21.5Al-1.5Si/Al接头界面结构均为Cu/扩散层/Al4.2Cu3.2Zn0.7,其中Al4.2Cu3.2Zn0.7化合物层厚度分别为1~2 μm和3~4μm.2种铜/铝接头钎缝中心区均由α-Al固溶体,η-Zn固溶体,Zn-Al共晶和Si单质组成,未发现脆性CuAl2化合物.由于具有较薄的界面化合物层,在剪切力作用下,Cu/Zn-14.1Al-0.9Si/Al接头断裂一部分起源于Al4.2Cu3.2Zn0.7化合物层,另部分起源于界面扩散层,而Cu/Zn-21.5Al-1.5Si/Al接头断裂均起源于较厚的Al4.2Cu3.2Zn0.7化合物层.因此,Cu/Zn-14.1Al-0.9Si/Al接头的抗剪切强度高于Cu/Zn-21.5Al-1.5Si/Al接头,分别为60.1MPa和55.6MPa. 相似文献