| 表面组装技术和片状元件在空间应用的可能性 |
| |
| 引用本文： | 董维芳.表面组装技术和片状元件在空间应用的可能性[J].中国空间科学技术,1990(3). |
| |
| 作者姓名： | 董维芳 |
| |
| 作者单位： | 西安空间无线电技术研究所 |
| |
| 摘 要： | 文章简单介绍了表面组装技术和片状元件的概况;结合卫星的特点,阐明了表面组装技术和片状元件在空间电子设备中应用的必要性和可能性。
|
| 关 键 词： | 片状元件 表面组装技术 空间 |
POSSIBILITY OF USING SURFACE MOUNT TECHNOLOGY AND CHIP COMPONENT IN SPACE APPLICATION |
| |
| Dong Weifang.POSSIBILITY OF USING SURFACE MOUNT TECHNOLOGY AND CHIP COMPONENT IN SPACE APPLICATION[J].Chinese Space Science and Technology,1990(3). |
| |
| Authors: | Dong Weifang |
| |
| Institution: | Xian Space Institute of Radio Technology |
| |
| Abstract: | This paper gives a brief introduction to surface mount technology and chip Components; According to Satellite's feature, this paper discusses the necessity and possibility of use of surface mount technology and chip component in space electroni equipments. |
| |
| Keywords: | Chip component Surface mount technology Space |
| 本文献已被 CNKI 等数据库收录！ |
