| 破坏性物理分析(DPA)在高可靠半导体器件质量验证中的作用 |
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| 引用本文： | 张延伟,于庆奎,何成山. 破坏性物理分析(DPA)在高可靠半导体器件质量验证中的作用[J]. 航天器环境工程, 1999, 0(2) |
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| 作者姓名： | 张延伟 于庆奎 何成山 |
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| 作者单位： | 北京卫星环境工程研究所 北京100029 |
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| 摘 要： | 文章介绍了破坏性物理分析(DPA)内容,以及它在高可靠性半导体器件质量验证中的作用。通过大量的数据表明,DPA 能有效地评价半导体器件的批质量.
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| 关 键 词： | 破坏性物理分析 高可靠性 质量保证 失效分析 生产批 |
THE APPLICATION OF DESTRUCTIVE PHYSICAL ANALYSIS(DPA) IN THE QUALITY VERIFICATION OF HIGH RELIABILITY SEMICONDUCTOR DEVICES |
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| Zhang Yanwei Yu Qingkui He Chengshan. THE APPLICATION OF DESTRUCTIVE PHYSICAL ANALYSIS(DPA) IN THE QUALITY VERIFICATION OF HIGH RELIABILITY SEMICONDUCTOR DEVICES[J]. Spacecraft Environment Engineering, 1999, 0(2) |
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| Authors: | Zhang Yanwei Yu Qingkui He Chengshan |
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| Abstract: | The paper describes the content of destructive physical analysis and application in the quality verification of high reliability semiconductor devices.large amount of statistical dats show that destructive physical analysis can effectively estimates the quality of Semiconductor Devices. |
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| Keywords: | Destructive Physical Analysis High reliability Quality assurance Failure analysis Product lot |
| 本文献已被 CNKI 等数据库收录！ |
