成膜基板烧结异常的分析及改进

某成膜基板在烧结后出现了析出透明物质的异常现象,严重影响了基板的键合强度。通过外观检查、SEM分析和能谱分析等手段,确定析出物为导体浆料中的玻璃相。分析结果表明,印刷厚度较厚是造成本次基板烧结异常的主要原因,但降低印刷厚度会对产品电性能产生影响。

Analysis and Improvement of Film Substrate Anomaly Sintering

A film substrate appear abnormal phenomenon of transparent material precipitation in the sintering

process, seriously affecting the strength of bonding. Through visual inspection, SEM analysis and spectrum analysis,

the main components of transparent material precipitated was determined as glass. After analysis, the thickness of the

printing exceeded is the main reason for the abnormal substrate sintering, However, decrease the thickness of the

printing will affect product performance