二氧化硅/双马来酰亚胺半固化片流变特性及其制备的覆铜板性能

研究经偶联剂KH550,KH560及KH570表面处理后的二氧化硅对双马来酰亚胺树脂体系流变特性的影响,通过DMA,TMA及TGA等测试手段表征所制备覆铜板的刚性、热膨胀系数及热稳定性。结果表明:采用KH560表面处理的二氧化硅/双马来酰亚胺树脂体系,较表面处理剂为KH550、KH570及未表面处理的二氧化硅/双马来酰亚胺树脂体系具有更好的流变特性和更低的熔融黏度;在树脂体系中引入二氧化硅,可以有效地提高覆铜板基材的综合性能,与未添加二氧化硅相比,具有更高的存储模量和更低的热膨胀系数;当二氧化硅质量分数为50%时,50℃时基材存储模量提高了83%,玻璃化转变温度以下的热膨胀系数α1降低了153%。

Rheology of Prepreg and Properties of Silica/bismaleimide Matrix Copper Clad Laminate

The effects of the silica surface treated by coupling agents KH550, KH560 and KH570 on the rheological properties of bismaleimide (BMI) resin system were investigated.The rigidity, coefficient of thermal expansion (CTE) and thermal stability of the copper clad laminate (CCL) were studied by DMA, TMA and TGA.The resin system containing silica surface treated by KH-560, comparing to KH550, KH570 and without surface treatment resin system has better rheological properties and low melt viscosity.The comprehensive properties of the copper clad laminate can be effectively improved by the introduction of silica in the resin system, exhibiting higher storage modulus and lower CTE compare to no silica in the CCL.When the silica mass fraction is 50% , the storage modulus is increased by 83% at 50 ℃, and the CTE below the glass transition temperature is decreased by 153%.