| 层合板热应力分析的辛正交解析法 |
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| 引用本文： | 邹贵平.层合板热应力分析的辛正交解析法[J].强度与环境,1997(3):1-8. |
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| 作者姓名： | 邹贵平 |
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| 作者单位： | 同济大学工程力学与技术科学系!上海，200092 |
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| 摘 要： | 基于一阶层合板理论，建立了以空间方向为模拟方向的层合板热应力分析的Hamilton正则方程、这样就突破了欧氏空间的限制，将其导入辛几何数学框架下，采用共轭辛正交方法给出层合板热应力分析的精确解。
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| 关 键 词： | 层压板 热应力 哈密顿方程 辛几何 复合材料 |
The Harmilton System and Symplectic Integration for the Thermal Stresses Analysis of Laminated Composite Plates |
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| Zou Guiping.The Harmilton System and Symplectic Integration for the Thermal Stresses Analysis of Laminated Composite Plates[J].Structure & Environment Engineering,1997(3):1-8. |
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| Authors: | Zou Guiping |
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| Abstract: | Based on the first-order composite plate theory, the Hamilton canonical equationfor thethermal stresses analysis of laminated composite plates in a space coordinate direction is derived, and thelevy type exact solution is also derived by the ad joint symplectic ortho-normality relations. |
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| Keywords: | Laminate Thermal Stress ~+Hamilton canonical equation ~+Symplectic Geometry |
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