| 高导热树脂基复合材料的研究进展 |
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| 引用本文： | 杨坤好,居建国,王晓蕾,左龙彦,谢钟清. 高导热树脂基复合材料的研究进展[J]. 宇航材料工艺, 2014, 44(5): 1-6 |
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| 作者姓名： | 杨坤好 居建国 王晓蕾 左龙彦 谢钟清 |
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| 作者单位： | 上海复合材料科技有限公司,上海,201112 |
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| 摘 要： | 综述了树脂基导热复合材料的导热机理及模型、种类以及影响因素,列举了金属、陶瓷、碳质以及混杂填料4种树脂基导热复合材料,分析探讨了树脂基体种类,导热填料种类、形状和用量,导热填料/树脂基体界面以及制备工艺等对复合材料导热性能的影响,并对高导热树脂基复合材料的应用前景和发展趋势进行了展望.
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| 关 键 词： | 高导热 树脂基复合材料 导热机理 模型 |
| 收稿时间： | 2014-07-15 |
Recent Advance of Resin-Based Composites With High Thermal Conductivity |
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| YANG Kunhao,JU Jianguo,WANG Xiaolei,ZUO Longyan and XIE Zhongqing. Recent Advance of Resin-Based Composites With High Thermal Conductivity[J]. Aerospace Materials & Technology, 2014, 44(5): 1-6 |
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| Authors: | YANG Kunhao JU Jianguo WANG Xiaolei ZUO Longyan XIE Zhongqing |
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| Abstract: | Recent advance of resin-based composites with high thermal conductivity is reviewed through threesections: mechanism and model of thermal conductivity, materials classification and the influencing factors. Accordingto the type of fillers, metal fillers, ceramic fillers, carbon fillers and hybrid fillers reinforced resin-based compositesare listed respectively. In addition, the effects of matrix, fillers, interface and fabrication method on the thermal conductivityof composites are discussed. Finally, we look to the bright future of high thermal conductive resin-basedcomposites. |
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| Keywords: | High thermal conductivity Resin-based composite Thermal conductive mechanism Model |
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