| 石墨渗铜喉衬材料的微观结构与抗热震性能 |
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| 引用本文： | 苏君明,陈林泉,王书贤,侯晓,李桂林,郝志敏,程文. 石墨渗铜喉衬材料的微观结构与抗热震性能[J]. 固体火箭技术, 2003, 26(3): 58-61 |
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| 作者姓名： | 苏君明 陈林泉 王书贤 侯晓 李桂林 郝志敏 程文 |
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| 作者单位： | 中国航天科技集团公司第四研究院,西安,710025 |
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| 基金项目： | 国家自然科学基金,批准号:59976037 |
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| 摘 要： | 采用粗粒级高强石墨加压渗铜工艺，制备了石墨渗铜(CIG：copper-impregnated graphite)喉衬材料。对其微观结构与抗热震性能的关系进行了研究。结果表明，由于渗铜提高了原石墨的热导率及整体增韧的综合效果，使石墨渗铜材料比通用的5种石墨材料具有更好的抗热震性能，更好地适应了小型高性能战术导弹、航天飞行器高压强大流量SRM对喉衬材料的要求。
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| 关 键 词： | 微观结构 抗热震性能 石墨渗铜材料 喉衬材料 热导率 航天材料 |
| 文章编号： | 1006-2793(2003)03-0058-04 |
| 修稿时间： | 2003-05-09 |
The microscopic structure and thermal shock resistance of copper-impregnated graphite throat insert material |
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| SU Jun-ming,CHEN Lin-quan,WANG Shu-xian,HOU Xiao,LI Gui-lin,HAO Zhi-min,CHENG Wen//The Fourth Academy of CASC,Xian ,China.. The microscopic structure and thermal shock resistance of copper-impregnated graphite throat insert material[J]. Journal of Solid Rocket Technology, 2003, 26(3): 58-61 |
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| Authors: | SU Jun-ming CHEN Lin-quan WANG Shu-xian HOU Xiao LI Gui-lin HAO Zhi-min CHENG Wen//The Fourth Academy of CASC Xian China. |
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| Affiliation: | SU Jun-ming,CHEN Lin-quan,WANG Shu-xian,HOU Xiao,LI Gui-lin,HAO Zhi-min,CHENG Wen//The Fourth Academy of CASC,Xian 710025,China. |
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| Abstract: | The copper-impregnated graphite ( CIG) throat insert material was made by means of impregnating copper to coarse granular graphite. The studied results on relation between microscopic structure and the property of thermal shock resistance are that the properties of copper-imperegnated thermal shock resistance of coarse granular graphite is more perfect than that of other five types of graphite in common use because impregnated copper to coarse granular has increased the thermal conductivity and improved the general effect of toughness. And for this reason, the material has met the expectations of throat insert material used in high performance tactical missile and space vehicles with high pressure, high flow rate solid rocket motor very well. |
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| Keywords: | solid rocket motor throat insert high-strength graph- ite copper-impregnated graphite microscopic structure thermal shock resistance |
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