High thermally conductive communications equipment panel module for communications satellite |
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| Institution: | 1. Institute of Research and Development, Duy Tan University, Da Nang 550000, Vietnam;2. Young Researchers and Elite Club, Kermanshah Branch, Islamic Azad University, Kermanshah, Iran;3. Department for Management of Science and Technology Development, Ton Duc Thang University, Ho Chi Minh City, Vietnam;4. Faculty of Civil Engineering, Ton Duc Thang University, Ho Chi Minh City, Vietnam;1. Key Laboratory of Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China;2. Beijing Key Laboratory of Heat Transfer and Energy Conversion, Tsinghua University, Beijing 100084, China |
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| Abstract: | A new communications equipment panel module for satellite use has been developed to obtain a high thermal conductivity across the thickness in transversal direction of the panel. As the conventional communications equipment panel has a sandwich structure with aluminum alloy face sheets and a honeycomb core, the transversal thermal conductivity is relatively small mainly due to epoxy resin adhesive layers between the face sheet and the honeycomb core. Therefore, in order to dissipate high-heat flux towards space, a complicated thermal control system becomes necessary. The new panel module consists of a carbon-fiber-reinforced aluminum-alloy face sheet and a titanium-alloy core. A metallic bonding is used as the connection between the face sheet and core to enhance thermal conductivity of the panel is 1 × 10−1 (W/K · mm) which is approx. 1000 times larger than that of the conventional panel. |
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