| 从有铅向无铅焊接过渡阶段应注意的问题 |
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| 引用本文： | 顾霭云,赵东明,曹白杨.从有铅向无铅焊接过渡阶段应注意的问题[J].华北航天工业学院学报,2005,15(3):1-5,9. |
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| 作者姓名： | 顾霭云 赵东明 曹白杨 |
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| 作者单位： | [1]公安部第一研究所,北京100000 [2]廊坊师范学院,河北廊坊065000 [3]北华航天工业学院电子工程系,河北廊坊065000 |
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| 摘 要： | 目前正处于从有铅向无铅焊接过渡的特殊阶段，无铅材料、印制板、元器件、检测、可靠性等方面都没有标准，无铅工艺方面在国内处于比较混乱的阶段。本文较全面地分析了无铅焊接的现状、无铅焊接的特点和对策、无铅焊接存在的主要问题，以及过渡阶段有铅、无铅混用应注意的问题。
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| 关 键 词： | 无铅焊接 无铅元器件 无铅印制板 无铅可靠性 |
| 文章编号： | 1009-2145（2005）03-0001-05 |
| 收稿时间： | 2005-06-01 |
| 修稿时间： | 2005-06-01 |
Application and Development of Surface Mount Technology |
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| Gu AiYun;Zhao DongMing;Cao BaiYang.Application and Development of Surface Mount Technology[J].Journal of North China Institute of Astronautic Engineering,2005,15(3):1-5,9. |
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| Authors: | Gu AiYun;Zhao DongMing;Cao BaiYang |
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| Abstract: | It is in the special stage to transfer from lead solder to lead-free solder. The things such as lead-free material, PCB,component,examination and reliability have no common standard. In this paper, the actuality of lead-free solder and its characteristics and countermeasures are introduced in detail, otherwise, the main problems of lead-free solder and the problems when lead solder and leadfree solder were used together that should be paid attention to during the transfer stage are also analyzed entirely. |
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| Keywords: | lead-free solder lead-free component lead-free PCB lead-free reliability |
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