| SiC颗粒增强Al基复合材料焊接工艺研究 |
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| 引用本文： | 曲文卿%张彦华%Sohail A.Khan%姚君山.SiC颗粒增强Al基复合材料焊接工艺研究[J].宇航材料工艺,2002,32(4):46-50. |
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| 作者姓名： | 曲文卿%张彦华%Sohail A.Khan%姚君山 |
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| 作者单位： | 1. 北京航空航天大学702教研室,北京,100083
2. 首都航天机械公司,北京,100076 |
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| 摘 要： | 通过SiC颗粒增强Al基复合材料与Al合金的焊接工艺试验研究，重点分析了材料组合，保湿工艺，连接时间等工艺参数对连接接头性能的影响以及连接接头的微观组织及成分分布，研究表明，TLP扩散连接是一种适用于复合材料连接的重要方法，在相同工艺条件下，LF6／SiCp-6061Al的接头性能明显优于LF6／SiCp-2024Al，连接时间过短或过长，都将影响到接头性能，并且连接时间对不同材料组合的影响也不同，采用二次保温工艺可以较大幅度地提高接头性能。
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| 关 键 词： | SiC颗粒增强Al基复合材料 焊接工艺 Al合金 TLP扩散连接 |
Study of Welding Process of SiC Particle Reinforced Al-based Composite |
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| Sohail A.Khan.Study of Welding Process of SiC Particle Reinforced Al-based Composite[J].Aerospace Materials & Technology,2002,32(4):46-50. |
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| Authors: | Sohail AKhan |
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| Institution: | Qu Wenqing Zhang Yanhua Sohail A.Khan ( Beijing University of Aeronautics and Astronautics Beijing 100083 )Yao Junshan ( Capital Aeronautics Mechanic Company Beijing 100076 ) |
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| Abstract: | Welding process of SiC p composite with aluminium alloy was studied, and the effect of the process parameters such as materials combinations, holding temperature , bonding time on the bonds properties is analyzed, the microstructure and concentration profile of the bonds are also analyzed. The results show that TLP diffusion bonding is an important process to join composite. Under the same conditions, the properties of LF6/SiC p 6061Al bonds are superior to that of LF6/SiC p 2024Al bonds. Too long or too short bonding time will affect the bond property, and the effect of time on bond property is different for different material combinations. Using two temperature holding process can improve the bond property significantly. |
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| Keywords: | SiC particle reinforced Al-based composite Aluminium alloy TLP diffusion bonding |
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