基于硅通孔的信息处理微系统关键技术研究

研究依托硅通孔实现信息处理微系统的技术.概述了传统信息处理系统小型化集成实现方式及新需求下所面临的发展瓶颈,依托"拓展摩尔定律"(More than Moore)战略成为信息处理系统具备高密度、多功能、多工作模式能力的重要实现方式,硅通孔TSV(Through Silicon Vias)为上述需求提供了重要的支撑手段;...

Research on key technologies of information processing microsystem based on Through Silicon Vias

This paper focuses on the information processing microsystem technologies based on Through Silicon Vias. Firstly, traditional information processing microsystem integrated implementation and development bottleneck under new demand are introduced, and relying on More than Moore strategy has become an important way to implement information processing microsystem with high density, multi function and more work pattern ability. All above requirements can be supported by TSV.The advantages of information processing microsystem and key technologies in design, realization and test are presented, and composition of various microsystem product have been showed at the same time. Finally, the application prospect of information processing microsystem products has been prospected with the advantages of key technologies to support the information processing microsystem.