短引脚PGA选择性波峰焊工艺技术

文摘针对装联过程中,PGA封装器件引脚过短的问题,分析了三种主要焊接工艺方法,采用选择性波峰焊接对短引脚PGA进行焊接试验,进而优化焊接工艺参数,并通过外观、X射线、金相剖切对焊接质量进行分析。结果表明:经过目视和X射线检测,选择性波峰焊接的短引脚PGA焊点无明显缺陷,金相图中焊锡与器件引脚、焊盘孔壁结合处良好,符合合格焊点要求。选择性波峰焊工艺方法具备焊接短引脚PGA的能力,有一定的应用价值。

Selective Wave Soldering Processing Technology of Short-Lead PGA

For the PGA package device leads in the assembly process is too short, the short-lead PGA is tested by selective wave soldering after analyzing the three main welding methods to optimize the welding process parameters, and the welding quality is discussed by looking at the appearance, X-ray and metallographic. The conclusion can be made that after visual inspection and X-rays inspection, no obvious solder joints defects are found in the short-lead PGA solder joints by selective wave soldering.The metallographic map of the solder joints show good welding at the joint,and meet the requirements of qualified intermetallic compound thickness. The selective wave soldering process method can realize short-lead PGA welding and has certain application value.