| 对接机构真空热试验外热流模拟方案研究 |
| |
| 引用本文： | 秦文波,程惠尔.对接机构真空热试验外热流模拟方案研究[J].上海航天,2008,25(6). |
| |
| 作者姓名： | 秦文波 程惠尔 |
| |
| 作者单位： | 上海交通大学机械与动力工程学院,上海,200240 |
| |
| 摘 要： | 根据对接机构的结构特点和真空热试验要求,提出了红外笼、电加热片,以及红外笼+加热片组合3种对接机构外热流模拟方案.仿真计算了在真空罐模拟环境中各方案对接机构构件的稳态温度分布,并与轨道环境进行了比较.确定了最大温差构件.结果表明:红外笼方案较简单,适于正样飞行产品;电加热片和红外茏+加热片方案的地面模拟准确性较佳,适于初样地面产品试验.
|
| 关 键 词： | 对接机构 真空热试验 外热流模拟 红外笼 加热片 |
Study on Simulation of External Flux in Vacuum Thermal Test of Docking Mechanism |
| |
| QIN Wen-bo,CHENG Hui-er.Study on Simulation of External Flux in Vacuum Thermal Test of Docking Mechanism[J].Aerospace Shanghai,2008,25(6). |
| |
| Authors: | QIN Wen-bo CHENG Hui-er |
| |
| Institution: | QIN Wen-bo,CHENG Hui-er(School of Mechanical Engineering,Shanghai Jiaotong University,Shanghai 200240,China) |
| |
| Abstract: | According to the structural characteristic and the test demand of docking,three schemes for external flux simulation which were infrared heating cage,heating chip and infrared heating cage + heating chip were presented in this paper.The stable temperature distribution in vacuum tank simulated environment of various components of docking mechanism for the 3 schemes was calculated by simulation,and results were compared to those in orbit environment.The component with maximum temperature difference was identi... |
| |
| Keywords: | Docking mechanism Vacuum thermal test External flux simulation Infrared heating cage Heating chip |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
