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预聚工艺对双马来酰亚胺/氰酸酯共聚物介电性能的影响
引用本文:钟翔屿,洪义强,包建文,陈祥宝. 预聚工艺对双马来酰亚胺/氰酸酯共聚物介电性能的影响[J]. 航空材料学报, 2006, 26(3): 351-352
作者姓名:钟翔屿  洪义强  包建文  陈祥宝
作者单位:1. 北京航空材料研究院,北京,100095
2. 北京服装学院,北京,100029
摘    要:研究了预聚工艺和后固化温度对双马来酰亚胺/氰酸酯共聚物介电性能的影响.研究表明:氰酸酯的预聚工艺对固化物的介电性能有影响;双马来酰亚胺预聚会增加固化物的介电损耗.

关 键 词:预聚  双马来酰亚胺/氰酸酯  介电性能
文章编号:1005-5053(2006)03-0351-02
修稿时间:2006-01-16

Effects of Prepolymerization Process on Dielectric Performance of Bismaleimide-Cyanate Ester Resin Systems
ZHONG Xiang-yu,HONG Yi-qiang,BAO Jian-wen,CHEN Xiang-bao. Effects of Prepolymerization Process on Dielectric Performance of Bismaleimide-Cyanate Ester Resin Systems[J]. Journal of Aeronautical Materials, 2006, 26(3): 351-352
Authors:ZHONG Xiang-yu  HONG Yi-qiang  BAO Jian-wen  CHEN Xiang-bao
Abstract:The effects of prepolymerization and postcure temperature on the dielectric performance of bismaleimide-cyanate ester copolymer are investigated in this article.The study shows the prepolymerization of cyanate ester has influence on dielectric performance.The prepolymerization of bismaleimide can increase dielectric loss dissipation.
Keywords:prepolymerization  bismaleimide-cyanate ester  dielectric performance  
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