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| 界面导热材料研究进展 | |
| 引用本文： | 丁孝均,赵云峰.界面导热材料研究进展[J].宇航材料工艺,2010,40(6). |
| 作者姓名： | 丁孝均 赵云峰 |
| 作者单位： | 航天材料及工艺研究所,北京 |
| 摘 要： | 综述了导热脂、导热胶黏剂、导热橡胶、导热胶带及相变材料等几类界面导热材料(TIMs)的组成成分、制备方法、主要性能、应用领域及其优化设计方法,并对国内外界面导热材料的发展进行了展望。 |
| 关 键 词： | 界面导热材料 导热 热阻 导热脂 导热橡胶 |
Progress of Thermal Interface Materials |
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| Ding Xiaojun,Zhao Yunfeng.Progress of Thermal Interface Materials[J].Aerospace Materials & Technology,2010,40(6). | |
| Authors: | Ding Xiaojun Zhao Yunfeng |
| Institution: | Aerospace Research Institute of Materials & Processing Technology,Beijing |
| Abstract: | Thermal interface materials (TIMs) are commonly used to reduce the thermal resistance between an electronic device and its cooling solution. This paper summarizes the progress in the design,composition,properties and application of TIMs in microelectronics. Finally,the developing trend of the technique is also pointed out. |
| Keywords: | Thermal interface materials Thermal conducting Thermal impedance Thermal conductive grease |
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