聚酰亚胺胶粘剂的粘接性能

 采用等摩尔的酮酐（BTDA）和醚胺（ODA）在N，N 二甲基甲酰胺(DMF)中合成了线形缩聚型聚酰胺酸(PAA)，并用红外光谱对其结构进行了表征，用TGA对其热关环亚胺化后进行了分析，结果表明其热分解温度可达600 ℃，所成薄膜具有良好的韧性。同时采用纳迪克酸酐（NA）为封端剂，通过调整NA/BTDA/ODA的比例，合成了不同分子量的PAA预聚体，并用红外光谱对其结构进行了表征，对其热关环亚胺化后进行差热分析，表明其端基交联固化温度为350 ℃左右，且随着分子量的提高峰温向高温方向移动。TGA表明，热固性聚酰亚胺（PI）交联固化后的热分解温度为483 ℃左右。采用上述线形缩聚型PAA与热固性PI共混，将固化后线形缩聚型PI的韧性与热固性PI高温性能结合起来，直接用做耐高温胶粘剂，可以获得较高的室温和高温剪切强度，并具有良好的高温热老化性能。

Adhesive Property of Polyimide Adhesive

A composite based on linear polyamide acid and thermosetting polyimide is prepared. After curing a semi interpenetrating polymer network (Semi IPN) structure is formed which combined the toughness and the heat resistance of both. The polyamide acid is synthesized by 3,3′,4,4′ Benzophenonetetracarboxylic dianhydride (BTDA) and 4,4′ Diaminodiphenylether (ODA). And with nadic anhydride as terminate thermosetting polyimide is prepared by the same monomer. The polyimides are characterized by IR, DSC and TGA, the linear polyimide (PI) does not show appreciable decomposition up to 600℃ and the film after cuing has good toughness.The cuing temperature of thermosetting PI is 350℃ which is detected by DSC,and peak value moves to high temperature with the increasing of molecular weight,the result by TGA shows that the temperature of decomposition is about 483℃.Blending of the two adhesives results in a new adhesive with good bonding strength and heat durability.