| Ti/Cu接触反应液相层生长规律研究 |
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| 引用本文： | 王艳芳.Ti/Cu接触反应液相层生长规律研究[J].航空精密制造技术,2009,45(1). |
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| 作者姓名： | 王艳芳 |
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| 作者单位： | 陕西工业职业技术学院材料科学与工程系,咸阳 712000;西北工业大学材料学院,西安 710072 |
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| 摘 要： | 针对Ti/Cu接触反应界面层的形貌以及液相层的出现和生长规律进行研究.以Cu/Ti/Cu嵌入式整体结构试验件为试验对象,研究接触熔化过程中,Ti/Cu扩散偶界面微观组织形貌的演变过程、界面反应层的出现以及生长规律.
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| 关 键 词： | 瞬间液相扩散焊 接触熔化 孕育期 |
Research on the Liquid Growth Mode of Ti/Cu |
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| WANG Yan-fang.Research on the Liquid Growth Mode of Ti/Cu[J].Aviation Precision Manufacturing Technology,2009,45(1). |
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| Authors: | WANG Yan-fang |
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| Institution: | 1. Department of Materials Science and Engineering;Shaanxi Polytechnic Institute;Xianyang 712000 2. College of Material;Northwestern Polytechnical University;Xi'an 710072 |
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| Abstract: | Aiming at Ti/Cu contact topography and liquid layer, growing regulation was studied. The microstructure of the Cu/Ti/Cu interface was investigated by using scanning electron microscope and the growing regulation of liquid layer was researched. |
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| Keywords: | Cu/Ti/Cu |
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