| 指尖密封的温度场及热结构耦合分析 |
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| 引用本文： | 苏华,陈国定.指尖密封的温度场及热结构耦合分析[J].航空动力学报,2009,24(1):196-203. |
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| 作者姓名： | 苏华 陈国定 |
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| 作者单位： | 西北工业大学机电学院, 西安 710072 |
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| 基金项目： | 国家自然科学基金，航空基础科学基金，教育部高等学校博士学科点专项科研基金 |
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| 摘 要： | 以单梁-双层密封片为单元建立了指尖密封热分析模型,依据指尖密封的实际工况确定了指尖密封热分析边界条件,通过有限元分析获得了不同工况条件下指尖密封的温度场分布,结果表明指尖密封的最高温度分布区域与高压腔气体温度高低有关,随着高压腔气体温度升高,最高温度分布区域自指尖靴部向高压密封片中部转移.在指尖密封热分析基础上进行了指尖密封热结构耦合分析,获得了考虑热效应的指尖密封的迟滞特性和接触性能.与不考虑温度影响的指尖密封性能分析结果相比,考虑热效应下的指尖密封的迟滞量减小,指尖与转子间的接触压力明显增大.
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| 关 键 词： | 指尖密封 温度场 热结构耦合 |
| 收稿时间： | 2007/12/25 0:00:00 |
| 修稿时间： | 3/5/2008 12:00:00 AM |
Analysis of temperature field and coupled thermal and structure for finger seal |
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| SU Hua and CHEN Guo-ding.Analysis of temperature field and coupled thermal and structure for finger seal[J].Journal of Aerospace Power,2009,24(1):196-203. |
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| Authors: | SU Hua and CHEN Guo-ding |
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| Institution: | School of Mechatronics, Northwestern Polytechnical University, Xi'an 710072, China |
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| Abstract: | The thermal analysis model for a repetitive section of single stick,two-layer finger seal was established herein.The thermal analysis boundary conditions were confirmed according to the finger seal's working situations.The temperature field in different conditions of the finger seal sections,including the rotor and the back plate,was obtained using the finite element method(FEM).It shows that the position of the highest temperature part of the finger seal is related to the upstream temperature.The highest t... |
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| Keywords: | finger seal temperature field coupled thermal and structural |
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