宇航用球栅阵列器件装联可靠性评价方法初探

针对球栅阵列（BGA）器件装联可靠性问题多发的现状，对常见宇航用BGA器件的结构及可靠性问题进行分析总结，并提出了一种基于失效物理的宇航用BGA器件装联工艺可靠性评价思路。通过案例分析，结合构成器件的元件和材料的典型特性，获得BGA器件常见失效模式及失效机理；并针对典型失效模式及机理选取疲劳寿命模型进行建模及仿真，依据Coffin-Manson的疲劳失效物理模型及其修正模型，得到工作寿命和试验寿命的预估结果；结合现有检测手段，综合考虑寿命预估结果，提出装联工艺可靠性评价试验项目，建立可靠性考核试验流程；基于国内外现有标准判据确定参考依据，综合考虑不同型号及应用环境的工作应力差别，提出BGA器件的可靠性分级评价量化准则。

A method for reliability evaluation of BGA assembly for aerospace application

In order to improve the assembly’s reliability of the BGA components, the structure and reliability problems of commonly used aerospace BGA components are analyzed in this paper. A method for the reliability evaluation of the BGA assembly based on the failure physics is proposed. The common failure mechanisms and failure modes are indentified in two aspects. The assembly failure cases are analyzed, as well as the typical characteristics of the structures and the materials of the components. According to the typical failure modes and mechanisms, the appropriate fatigue life model is set up, and the relevant simulation is conducted. According to the Coffin-Manson's fatigue failure physical model and its modified version, the working life and the test life are predicted. Meanwhile, by combining the existing detection equipment and considering the lifetime prediction result, we put forward the reliability evaluation test items, and establish the relevant evaluation process. Based on the existing standard criteria at home & abroad, and the overall consideration of working stress differences among various models and environments, a quantitative criterion for grading the reliability evaluation is proposed in the end.