Problem of Circular Hole in Thermopiezoelectric Media with Semi-permeable Thermal Boundary Condition |
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| Authors: | Song Haopeng Hu Wei Gao Cunfa |
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| Affiliation: | State Key Laboratory of Mechanics and Control of Mechanical Structures,Nanjing University of Aeronautics & Astronautics, Nanjing, 210016, P.R. China |
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| Abstract: | The semi-permeable boundary condition is proposed to discuss the influence of the thermal conductivity acting on the stress and heat flow around the hole.Based on the Stroh formalism,the closed form solutions are derived,the stress and heat flow around the hole are discussed.The results show that the thermal boundary condition has significant influence on the hoop stress and heat flow around the hole.The hoop stress decreases dramatically with the increasement of the thermal conduction coefficient. |
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