微胶接装配中胶接区表面结构实验

微胶接技术非常适用于微机电系统产品的自动化装配过程.微胶接装配质量容易受到2个因素的影响,即胶滴体积的不稳定和胶滴的扩散.为了解决该问题,对微胶接装配中的胶接区表面结构进行了研究.提出2种表面结构:基本的凹槽结构和胶滴自居中结构,并进行实验.实验结果表明,凹槽结构对胶滴体积具有一定的"容错性",可以有效克服胶滴体积的不稳定和胶滴的扩散对微胶接装配质量的影响;自居中结构使得胶滴在凹槽内具有"自居中"的特性,可以减轻微装配系统定位误差对装配质量的影响.这2种表面结构可用于通用微机电系统产品的装配中,以提高微胶接装配的质量.

Experiments on surface structure for micro assembly using adhesive bonding

Micro adhesive bonding technology shows great potential in the assembly of micro-electro-mechanical system(MEMS) products.The quality of micro assembly using adhesive bonding is sensitive to two factors:the fluctuation of the adhesive volumes and the spread of the meniscus.In order to solve this problem,two surface structures on the bonding area were experimentally studied,which were the groove structure and meniscus-self-centering structure.Experiment results show that,the former structure has the ability of "fault-tolerance" to the volume of meniscus,and can overcome the influence of the mentioned factors on the quality of micro adhesive bonding;the latter structure enables meniscus to spread itself to the center of the groove,and thus to weaken the influence of the position error of micro assembly system.The two studied surface structures can be applied into the assembly of general MEMS products.