用于热真空环境下整星微波无线测试的低PIM吸波热沉研制

随着通信卫星技术的发展,收发共用已成为通信卫星有效载荷常用的设计方法,在这种情况下,无源互调(passive intermodulation,PIM)问题就显得尤为突出。为了完成整星及转发器分系统在热真空环境下的PIM指标测试,利用碳化硅吸波材料研制了一种低PIM吸波热沉,并利用该吸波热沉建立了指标小于150 dBm的低PIM测试环境,同时兼具热流模拟功能和微波功率耐受能力。在热真空环境下圆满完成了国内首次有整星参与的微波载荷无线PIM测试试验。

Development of low-PIM absorbing heat sink in microwave load wireless test for spacecraft in thermal vacuum environment

With the development of the communication satellite technology, the sending and receiving system becomes a common design target for the communication satellite payload, and the passive intermodulation (PIM) becomes particularly prominent. In order to complete the low PIM index test of the satellite transponder system in the thermal vacuum environment, a low PIM heat sink is developed by using the silicon carbide absorbing material. The heat sink not only provides a low-PIM test environment with an indicator of less than 150 dBm, but also enjoys the heat flow simulation function and the microwave power tolerance in the vacuum heat test. The first microwave load wireless PIM test in China is successfully completed with the help of the satellite