| 半球谐振陀螺装配技术的发展现状及趋势 |
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| 作者姓名： | 金 鑫 刘晓豪 李绍良 李朝将 李寅岗 陈效真 蔚 行 |
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| 作者单位： | 北京理工大学 机械与车辆学院;上海航天控制技术研究所 惯性工程技术研究中心;北京航天控制仪器研究所 |
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| 基金项目： | 上海航天科技创新基金项目（SAST2020-061） |
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| 摘 要： | 目前半球谐振陀螺装配过程中存在着装配精度低、一致性差、成品率低等问题，半球谐振陀螺装配技术的短板制约半球谐振陀螺性能指标提升、高合格率和批量化生产。文章通过调研半球谐振陀螺产品研究现状，分析了影响半球谐振陀螺精度的因素，阐述了在半球谐振陀螺的装配过程中亟需突破的关键技术，包括面向装配的几何误差建模、无损柔性夹持技术、铟焊低应力连接装配工艺、非平行板电容精密检测等关键技术，并对半球谐振陀螺装配技术的发展趋势进行展望。
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| 关 键 词： | 半球谐振陀螺 精密装配 误差建模 铟焊连接 低应力装配 |
Development Status and Trend of Hemispherical Resonator Gyroscope Assembly Technology |
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| Authors: | JIN Xin LIU Xiaohao LI Shaoliang LI Chaojiang LI Yingang CHEN Xiaozhen YU Hang |
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| Institution: | School of Mechanical Engineering, Beijing Institute of Technology;Shanghai Engineer Research Center of Inertia, Shanghai Aerospace Control Technology Institute;Beijing Institute of Aerospace Control Devices |
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| Abstract: | At present, the assembly process of the hemispherical resonant gyroscope(HRG) has problems such as low assembly accuracy, poor consistency and low yield. The shortcoming of the hemispherical resonant gyroscope assembly technology is one of the main reasons that restrict its performance index improvement, high qualification rate and mass production. First, it summarizes the research status of hemispherical resonant gyroscope products, summarizes the key technology of hemispherical resonant gyroscope assembly, and explains the urgent need to break through the assembly-oriented geometric error modeling technology, non-destructive flexible clamping technology, indium key technologies such as welding connection process and precision detection technology of non-parallel plate capacitance. And finally analyze the development trend of hemispherical resonant gyroscope assembly technology. |
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| Keywords: | HRG precision assembly error modeling indium welding connection low-stress assembly |
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