| 工件旋转式磨削大直径硅片技术的研究进展 |
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| 引用本文： | 孙玉利%左敦稳%朱永伟%布光斌%王鸿翔.工件旋转式磨削大直径硅片技术的研究进展[J].宇航材料工艺,2006,36(5):21-26. |
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| 作者姓名： | 孙玉利%左敦稳%朱永伟%布光斌%王鸿翔 |
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| 作者单位： | 南京航空航天大学机电学院,南京,210016 |
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| 摘 要： | 在分析单晶硅片的典型加工工艺基础上,介绍了基于工件旋转式磨削法的大直径硅片超精密加工技术的原理及特点,综述了该项技术的试验研究进展及建立的数学模型,分析了有限元法在工件旋转式磨削硅片研究中的应用,最后提出了工件旋转式磨削大直径硅片技术目前存在的问题和今后的发展趋势。
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| 关 键 词： | 大直径硅片 超精密加工 工件旋转式磨削 平整度 |
| 收稿时间： | 2005-11-01 |
| 修稿时间： | 2005-11-012006-03-13 |
Research Advances of the State-of-Art of Work-Rotation Grinding for Large-Scale Silicon Wafers |
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| Sun Yuli,Zuo Dunwen,Zhu Yongwei,Bu Guangbin,Wang Hongxiang.Research Advances of the State-of-Art of Work-Rotation Grinding for Large-Scale Silicon Wafers[J].Aerospace Materials & Technology,2006,36(5):21-26. |
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| Authors: | Sun Yuli Zuo Dunwen Zhu Yongwei Bu Guangbin Wang Hongxiang |
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| Abstract: | Based on analysis of the typical processing technics for silicon wafers, the mechanism and characteristics of work-rotation grinding-based method are presented . The latest development in the experimental study of ultra-precision machining technology for large-scale silicon wafers based on work-rotation and the mathematical models are introduced. The application of the finite element method in this field is analyzed. Finally, the problems and development trends of this technique are pointed out. |
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| Keywords: | Large-Scale silicon wafers Ultra-Precision machining Work-Rotation grinding Flatness |
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