插拔冲击载荷下的印刷电路板全场应变预示方法

针对某产品印刷电路板受插拔冲击载荷导致的焊脚损伤失效案例，研究根据插拔端施力预示电路板全场受力位置及响应的有效方法。首先将预制的整体应变计粘贴于电路板狭窄空间，获取印刷线路板上各关键测点位置的应变数据；然后基于克里金代理模型拟合出各测点在非工作状态插拔工况下整张电路板的全场应变分布情况；进而建立施力端应变数据与受力端应变数据的关系模型。实测与预示结果的误差在10%以内，验证了该方法的有效性。该方法可为该类印刷电路板全场应力分析、失效分析及测点剪裁提供参考。

Method for full-field strain prediction of printed circuit board under impact load of insertion-extraction

In view of the failure case of weld leg damage on the printed circuit board (PCB) of a product induced by the impact load of insertion-extraction, an effective method to predict the full-field force position and response of the circuit board according to the force applied to the insertion-extraction end was studied. First, the prefabricated integral strain gauge was pasted onto the narrow space of the circuit board to obtain the strain data of each key point on the PCB. Then, the full-field strain distributions on the whole out-of-service board under insertion-extraction conditions were fitted based on the Kriging surrogate model. Furthermore, the model of strain data relationship between the pulling location and the slots was established. The error between measured and predicted results is within 10%, which verifies the effectiveness of the proposed method. This method may provide a reference for full-field strain analysis, failure analysis and measurement point tailoring of PCB.