矩形微槽内FC-72的单相流动和换热实验研究

微槽换热器是解决航空电子设备元器件热控制问题的一条有效途径.以新型电子设备冷却液FC-72为工质,利用4种不同结构尺寸的矩形微槽,进行了微槽内单相流动和强迫对流换热性能实验研究;分析了工质流速、过冷度以及微槽结构等对换热性能的影响,给出了适用于层流和紊流的单相流动阻力特性实验关联式和单相强迫对流换热实验关联式,并对实验结果进行了不确定度分析.结果表明,在矩形微槽换热器中,FC-72的单相强迫对流换热能力能够满足中高强度的电子设备散热要求. 

Experimental study on single-phase flow and heat transfer for FC-72 in rectangular microchannels

The microchannel heat sink provides an efficient method to solve thermal control problems of the aviation electronic components. The experiment of single-phase flow and forced convective heat transfer was carried out with FC-72 which was a good prospective electronic cooling fluid. Four rectangular microchannel heat sinks were used which had different structural parameters. The influences of liquid velocity, supercooling temperature and microchannel structures were analyzed. The correlations of single-phase flow resistance and forced convective heat transfer were given, and the uncertainty for experiment data was evaluated. The results show that the single-phase forced convective heat transfer characteristic of FC-72, flowing in rectangular microchannel heat sinks, can satisfy the heat dissipation requirements of middle or high flux for electronic devices.