| Al合金与复合材料LID连接接头微观结构分析 |
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| 引用本文： | 曲文卿%张彦华%王奇娟.Al合金与复合材料LID连接接头微观结构分析[J].宇航材料工艺,2002,32(5):50-53. |
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| 作者姓名： | 曲文卿%张彦华%王奇娟 |
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| 作者单位： | 1. 北京航空航天大学702教研室,北京,100083
2. 北京卫星制造厂,北京,100080 |
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| 摘 要： | 通过SiC颗粒增强Al基复合材料与Al合金的液相界面扩散 (LID)连接试验 ,重点研究了连接接头区域的微观组织 ,并简要分析了接头中各元素的浓度分布情况。结果表明 ,LID连接Al基复合材料和Al合金形成的界面明显向Al合金一侧偏移 ,并且溶质原子在界面两侧分布存在明显的不对称现象。研究结果为异种材料的连接提供了重要的科学依据
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| 关 键 词： | 异种材料 液相界面扩散连接 中间层 微观结构 |
| 修稿时间： | 2002年5月13日 |
Microstructure Analysis of LID Bonds of Al-alloy and Composite Material |
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| Qu Wenqing,Zhang Yanhua.Microstructure Analysis of LID Bonds of Al-alloy and Composite Material[J].Aerospace Materials & Technology,2002,32(5):50-53. |
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| Authors: | Qu Wenqing Zhang Yanhua |
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| Institution: | Qu Wenqing Zhang Yanhua ( Beijing University of Aeronautics and Astronautics Beijing 100083 ) Wang Qijuan ( Beijing Satellite Manufacturing Factory Beijing 100076 ) |
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| Abstract: | Microstructure of LID bonding area and concentration profile of the bonds are studied through the LID bonding tests of SiC particle reinforced Al based composite and aluminium alloy.Experimental results show that the bond interface departures from original central line to aluminium alloy in the LID bonds of Al based composite and aluminium alloy, and solute atoms distribute fairly asymmetrically around the joint area. The study provides a scientific basis for bonding of the dissimilar materials. |
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| Keywords: | Dissimilar material LID bonding Interlayer Microstructure |
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