基于弹塑性理论的新型接触热导模型

提出了一种新型接触热导的模型。充分考虑界面上微凸体的变形,根据微凸体变形连续的特点,分别给出了弹性、弹塑性、塑性三种变形时的接触方程。用Weierstrass-Mandelbrot分形函数描述粗糙表面轮廓曲线,并考虑了接触点的基体热阻及其界面收缩热阻,构建了分形热阻网格模型,分析了接触热导与载荷的关系,与实验数据及模型、Mikic弹性模型和Yovanovich塑性模型的预测值进行了比较。结果表明:该模型能较好地预测界面接触热导,有其合理性。

New Model for Thermal Contact Conductance Based on Elastic-Plastic Theory

A new model was used to predict thermal contact conductance in this paper.In full consideration of the deformation of asperities in contact surface,contact equations of elastic,elastoplastic and plastic deformation of asperities were set up according to the character of continuous deformation of asperities.Weierstrass-Mandelbrot fractal function was used to describe the profile of rough surface because of its fractal feature.A fractal network model for thermal contact resistance was established,taking into consideration of both substrate resistance and surface resistriction resistance.The relation between contact conductance and load was analyzed.The comparison result of this new model with experiment data and model,Mikic elastic model and Yovanovich plastic model showed that this new model could well predict thermal contact conductance,and it was reasonable for this model.