| 基于光切法的微结构三维尺寸测量 |
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| 引用本文： | 李晓莹,马炳和,苑伟政.基于光切法的微结构三维尺寸测量[J].航空精密制造技术,1998(5). |
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| 作者姓名： | 李晓莹 马炳和 苑伟政 |
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| 作者单位： | 西北工业大学微机械与微细加工技术研究室 |
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| 摘 要： | 针对微机械结构加工特点及其对相应测量技术所提出的特殊要求，运用光切法对三维微结构尺寸测量（尤其是高度尺寸）进行了实验研究和理论分析，阐明了其可行性与潜在优势。
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| 关 键 词： | 微结构 三维尺寸测量 光切法 |
Light Sectioning for Measuring 3D Micro-dimensions * |
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| Li Xiaoying,Ma Binghe,Yuan Weizheng.Light Sectioning for Measuring 3D Micro-dimensions *[J].Aviation Precision Manufacturing Technology,1998(5). |
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| Authors: | Li Xiaoying Ma Binghe Yuan Weizheng |
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| Abstract: | By investigating the characteristics of present micro-machining for microstructure,its corresponding measuring technology is studied.On this basis,the feasibility and potentiality of light sectioning for measuring 3D Micro-dimensions (especially height) are analyzed theoretically and examined by doing experiments. |
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| Keywords: | microstructure 3D measurement light sectioning |
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