首页 | 本学科首页   官方微博 | 高级检索  
     检索      

硅基材料烧蚀模型研究
引用本文:孙冰,林小树,刘小勇,蔡国飙.硅基材料烧蚀模型研究[J].宇航学报,2003,24(3):282-286,308.
作者姓名:孙冰  林小树  刘小勇  蔡国飙
作者单位:1. 北京航空航天大学宇航学院,北京,100083
2. 航天科工集团公司三十一所,北京,100074
基金项目:国防预研项目 (2 6.4.1/ A960 0 3 1-0 2 )
摘    要:对冲压发动机燃烧室所使用的硅基热防护材料,用以往的单纯因二氧化硅液态层被气动吹除减薄的模型进行烧蚀计算,计算结果和实际偏差很大。我们根据硅基热防护材料的实际特性,在原有的液态层模型的基础上,考虑了夹杂碳化层对熔融态硅基的补强作用,提出了既有液态层吹除也有化学反应烧蚀的新模型,即考虑了热解、熔融和碳化、气动吹除结合化学反应烧蚀的多因素过程。并根据硅基热防护材料的烧蚀特点,根据发动机模型的试验结果,初步总结出了液态层粘附力的经验公式。从物理概念上分析可以看出该模型基本符合实际情况;从多种工况计算结果可看出,新模型和经验公式是比较合理的。

关 键 词:烧蚀  模型  计算  冲压发动机  硅基材料
文章编号:1000-1328(2003)03-0282-05

Study on ablation model of silica-reinforced composites
SUN Bing ,LIN Xiao-shu ,LIU Xiao-Yong ,CAI Guo-biao.Study on ablation model of silica-reinforced composites[J].Journal of Astronautics,2003,24(3):282-286,308.
Authors:SUN Bing  LIN Xiao-shu  LIU Xiao-Yong  CAI Guo-biao
Institution:SUN Bing 1,LIN Xiao-shu 2,LIU Xiao-Yong 2,CAI Guo-biao 1
Abstract:Previous models of ablation computation about Silica-reinforced thermal protection materials used in the combustion of ramjet engines only simulated the recession of silica liquid layer due to aerodynamics blow,thus,the results did not match the reality well.Based on the former liquid layer model,a new model was proposed considering the strengthen function of mixed carbon layer to molten silicon,which concluded the blow of liquid layer and ablation with chemical reaction,i.e.the multi-factor process of pyrogenation,liquation and carbonization,as well as blow and ablation with chemical reaction,were simulated in the model.And then preliminary experiential formula for liquid layer adhesion were brought out,according to the ablativity of Silica-reinforced thermal protection materials and experimental data of ramjet engines.Analyzed physical concept,the model is in good agreement with reality.And the multi-cases results indicate that the new model and experiential formula are rational.
Keywords:Ablation  Models  Computation  Ramjet engines  Silica-reinforced materials
本文献已被 CNKI 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号