| Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷与接头质量控制 |
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| 引用本文： | 邹贵生,吴爱萍,任家烈,李盛,任维佳.Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷与接头质量控制[J].航空材料学报,2001,21(1). |
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| 作者姓名： | 邹贵生 吴爱萍 任家烈 李盛 任维佳 |
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| 作者单位： | 清华大学机械系, |
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| 基金项目： | 国家自然科学基金项目! (5 96 75 0 0 5 6 ) |
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| 摘 要： | 研究了Ti/Ni/Ti复合层TLP扩散连接Si3 N4 陶瓷。结果表明 ,Ni Ti过渡液相存在时间短 ,在此期间形成的界面结合强度低 ;必须进一步固态扩散反应才能形成高强度接头 ,相应的接头显微结构为 :Si3 N4 /TiN/Ti5Si3+Ti5Si4 +Ni3 Si/NiTi/Ni3 Ti/Ni。连接时间、连接温度、连接压力及Ti和Ni的厚度影响接头组织和强度 ,其最佳值为 6 0min ,10 5 0℃、2 .5MPa、2 0 μm和 40 0 μm ,所得接头室温和 80 0℃剪切强度分别为 142MPa和 6 1MPa。
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| 关 键 词： | TLP扩散连接 Si3N4陶瓷 高温强度 |
TLP diffusion bonding of Si3N4 ceramics using Ti/Ni/Ti multilayer and controlling of joints＇ quality |
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| ZOU Gui-sheng,WU Ai-ping,REN Jia-lie,LI Sheng,REN Wei-jia.TLP diffusion bonding of Si3N4 ceramics using Ti/Ni/Ti multilayer and controlling of joints＇ quality[J].Journal of Aeronautical Materials,2001,21(1). |
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| Authors: | ZOU Gui-sheng WU Ai-ping REN Jia-lie LI Sheng REN Wei-jia |
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| Abstract: | TLP diffusion bonding of Si3 N4 ceramics with Ti/Ni/Ti multilayer was investigated. The existing time of Ni-Ti transient liquid phase is short, and the strength of the interface formed within this duration is very low. The formation of strong joints needs further solid-state diffusion reaction, and its microstructures is Si3N4/TiN/TisSi3 + TisSi4 + Ni3Si/NiTi/Ni3Ti/Ni. The joints＇ strength is affected by bonding parameters, which include bonding time、bonding temperature、bonding presssure、thickness of Ti or Ni. The shear strength of joints at room temperature and 800℃ could reaches 142MPa and 61MPa, respectively. |
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| Keywords: | transient liquid phase diffusion bonding Si 3N 4 ceramics high temperature strength |
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