印刷电路板无源互调机理研究进展

当前印刷电路板广泛应用于现代电子设备中，通信频率、功率和数据信号容量的增加对基于印刷电路板的设备的无源互调性能提出了极其严格的要求。文章综合论述了国内外印刷电路板无源互调问题的研究现状，从电路板涉及的相关无源互调机理研究出发，梳理了目前印刷电路板中无源互调机理研究的经典建模，并进一步总结了当前印刷电路板无源互调测试的热点研究方向。文章从印刷电路板材料的选择及平面电路的设计方面综述了无源互调抑制方法。将为之后工程应用中无源互调机理的研究和建立无源互调分析的非线性模型提供技术参考。同时在建立高精度无源互调测试平台，进行无源互调定位与诊断技术研究，建立无源互调预测和验证平台方面也有重要的参考价值。

Passive intermodulation study of printed circuit board

Currently, printed circuit boards are widely used in modern electronic devices. The increase in communication frequency, power, and data signal capacity has placed extremely strict requirements on the passive intermodulation performance of devices based on printed circuit boards. Therefore, this article comprehensively discusses the current research status of passive intermodulation on printed circuit boards at home and abroad. Starting from the relevant research on passive intermodulation mechanisms involved in circuit boards, it combs out the classic modeling of the current research on passive intermodulation mechanisms in printed circuit boards, and further summarizes the current hot research directions of passive intermodulation testing on printed circuit boards. This article summarizes passive intermodulation suppression methods from the selection of printed circuit board materials and planar circuit design. It will provide technical references for the study of passive intermodulation mechanisms in future engineering applications and the establishment of nonlinear models for passive intermodulation analysis. At the same time, it has important reference value in establishing a high-precision passive intermodulation testing platform, conducting research on passive intermodulation positioning and diagnosis technology, and establishing a passive intermodulation prediction and verification platform.