反熔丝FPGA器件真空发热及散热措施

航天电子元器件工作于真空环境时,必须格外考虑其发热及散热问题.文章对某反熔丝FPGA器件工作于真空环境时温度与功耗的关系及散热措施进行研究.通过热真空试验得到该器件不同散热措施及PCB条件下的发热及散热情况数据,并依据数据分析给出其在真空环境下的散热措施建议.该器件采用了带热沉的陶瓷四侧扁平208引脚封装(CQFP20...

Vacuum heating and heat dissipation measures for antifuse FPGAs

For aerospace electronic components to be worked in the vacuum environment, the device heating and the related heat dissipation must be specially considered. In this paper, the relationship between the temperature of a certain type of antifuse FPGAs working in the vacuum environment and the power consumption are studied, together with measures of heat dissipation. Through thermal vacuum test, the thermal value and the heat dissipation data of the devices with regard to different heat dissipation measures and various PCB conditions are obtained. Finally, the heat dissipation measures for the devices in vacuum environment are suggested. The device adopts a ceramic four-side flat 208-pin package (CQFP208) with heat sink. It is the first time in China to introduce comparable-sized heat sink (23 mm×23 mm) into such large size package (porcelain 29.2 mm×29.2 mm) and apply it to spacecraft. The test results and the heat dissipation measures proposed in this paper can serve as a reference for the applications of the electronic components with the same or similar kind of package.