| 表面组装技术的应用与发展（下） |
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| 引用本文： | 顾霭云,曹白杨.表面组装技术的应用与发展（下）[J].华北航天工业学院学报,2003,13(4):1-7. |
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| 作者姓名： | 顾霭云 曹白杨 |
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| 作者单位： | [1]公安部第一研究所，北京100000 [2]华北航天工业学院电子系工程系，河北廊坊065000 |
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| 摘 要： | 本文主要对表面组装技术的特点、表面组装工艺和表面组装技术的现状及发展趋势进行了全面的介绍，并分析了贴片机、网板印刷机、回流焊、波峰焊对表面组装工艺的影响。
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| 关 键 词： | 表面组装技术 印制电路板 贴片机 网板印刷机 回流焊 波峰焊 |
Application and Development of Surface Mount Technology |
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| GU Ai-yunCAO Bai-yang.Application and Development of Surface Mount Technology[J].Journal of North China Institute of Astronautic Engineering,2003,13(4):1-7. |
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| Authors: | GU Ai-yunCAO Bai-yang |
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| Institution: | GU Ai-yun~1CAO Bai-yang~2 |
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| Abstract: | This paper introduces the feature of the Surface Mount Technology, the Surface Mount Process and the development of Surface Mount Technology. It also analyses the Screen Printer, Chip Shooter, Reflow Soldering and Wave Soldering influence the Surface Mount Process. |
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| Keywords: | surface mount technology printed circuit board chip shooter screen printer reflow soldering wave soldering |
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