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印刷电路板缺陷焊点的自动检测
引用本文:战德臣 陈景春. 印刷电路板缺陷焊点的自动检测[J]. 宇航学报, 1991, 0(3): 76-82
作者姓名:战德臣 陈景春
作者单位:哈尔滨工业大学(战德臣,陈景春,李仲荣),哈尔滨工业大学(吕跃广)
摘    要:
本文首先从国内外的发展现状,概述了印刷电路板缺陷焊点的几种检测手段。并着重介绍了作者与其同事们正在研制的激光全息印刷电路板焊点缺陷自动检测系统。

关 键 词:印刷电路板 自动检测 全息干涉

AUTOMATIC INSPECTION OF DEFECTIVE SOLDER JOINT ON PRINTED CIRCUIT BOARD
Zhan Dechen Chen Jingchun Li Zhongrong Lu Yueguang. AUTOMATIC INSPECTION OF DEFECTIVE SOLDER JOINT ON PRINTED CIRCUIT BOARD[J]. Journal of Astronautics, 1991, 0(3): 76-82
Authors:Zhan Dechen Chen Jingchun Li Zhongrong Lu Yueguang
Affiliation:Harbin Institute of Technology
Abstract:
This paper first reviews the recent development of Several inspection methods and mainly introduces the Holographic inspection system of PCB Solder joint defects, which is tried and implemented by the authors and their coleagues. Holographic inspection method is a newer one of PCB solder joint inspection. The principle of holographic inspection and the composition of the inspection system are described in detail in this paper, and the experimental result is given.
Keywords:PCB   Automatic inspection   Holographic interfere   Machine vision.  
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