星地高速数传系统LDPC编码器ASIC集成芯片设计

面向高分辨率对地观测卫星的高速数传应用需求，提出了一种低实现复杂度、多码率融合的LDPC并行编码结构，以及采用该结构的编码器芯片设计方案。基于TSMC 130 nm CMOS标准单元库，该编码器芯片在200 MHz时钟下能够达到1.6 Gbps的吞吐率，硅片面积为5.495 mm 2，功耗仅为184.3 mW。与传统结构设计的相同吞吐率的LDPC编码器芯片相比，本文方案可以将存储空间需求降至传统结构的18.52%，硅片面积和功耗分别下降至传统结构的20.3%和83.3%，非常适用于超高速星上通信应用。

ASIC Design of an LDPC Encoder for Satellite-Ground High-Speed Data Transmission System

In this paper, a high-speed and multi-code-rate low density parity check(LDPC) encoder architecture is proposed for the LDPC codes used in high-speed satellite-ground data transmission of the Chinese high resolution earth observation satellite. Synthesized with Taiwan semiconductor manufacturing company (TSMC) 130 nm complementary oxide metal semiconductor (COMS) standard cell library, the designed multi-code-rate LDPC encoder can achieve 1.6 Gbps throughput in 200 MHz clock frequency, the die size of which is only 5.495 mm 2, and the dynamic power dissipation of which is only 184.3 mW. Compared with the encoder designed by the traditional LDPC encoder architecture, the memory size, the die size, and the power consumption of the new encoder can be reduced by 18.52%, 20.3% and 83.3% respectively.