| SiCf/SiC陶瓷基复合材料制孔工艺 |
| |
| 引用本文： | 谢巍杰,邱海鹏,陈明伟.SiCf/SiC陶瓷基复合材料制孔工艺[J].宇航材料工艺,2016,46(5):50-53. |
| |
| 作者姓名： | 谢巍杰 邱海鹏 陈明伟 |
| |
| 作者单位： | 中航复合材料有限责任公司,北京 101300,中航复合材料有限责任公司,北京 101300,中航复合材料有限责任公司,北京 101300 |
| |
| 摘 要： | 分别采用机械钻削制孔与激光制孔两种工艺对SiC_f/SiC陶瓷基复合材料进行制孔,对其质量以及工艺特点进行评价分析。结果表明,机械钻削制孔孔径精度较好但存在刀具磨损严重、出现毛刺崩边现象等问题;激光制孔效率较高,但孔存在锥度且因热影响区的存在导致孔的内壁表面出现分层、裂纹等缺陷。
|
| 关 键 词： | 陶瓷基复合材料 机械制孔 激光制孔 |
| 收稿时间： | 2015/11/14 0:00:00 |
Drilling Process For SiCf/SiC Ceramic Matrix Composites |
| |
| XIE Weijie,QIU Haipeng and CHEN Mingwei.Drilling Process For SiCf/SiC Ceramic Matrix Composites[J].Aerospace Materials & Technology,2016,46(5):50-53. |
| |
| Authors: | XIE Weijie QIU Haipeng and CHEN Mingwei |
| |
| Institution: | AVIC Composite Corporation Ltd., Beijing 101300,AVIC Composite Corporation Ltd., Beijing 101300 and AVIC Composite Corporation Ltd., Beijing 101300 |
| |
| Abstract: | SiCf/SiC composites were drilled by machining process and laser process. The quality of holes and the characteristics of the two processes were analysed. The results show that machining drilling can get holes with better diameter but there are serious tool wear, burr side damage problems. Laser drilling has a better efficiency but there is taper hole and the existence of heat affected zone of wall surface causes defects such as delamination and crack. |
| |
| Keywords: | Ceramic matrix composites Machining drilling Laser drilling |
| 本文献已被 CNKI 等数据库收录！ |
| 点击此处可从《宇航材料工艺》浏览原始摘要信息 |
| 点击此处可从《宇航材料工艺》下载免费的PDF全文 |
|
