| 封装内系统技术在航电设备小型化中的应用初探 |
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| 引用本文： | 汪溢,王经典,刘建中. 封装内系统技术在航电设备小型化中的应用初探[J]. 航空电子技术, 2013, 0(4): 51-55 |
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| 作者姓名： | 汪溢 王经典 刘建中 |
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| 作者单位： | [1]海军驻上海地区航空军事代表室,上海200233 [2]中国航空无线电电子研究所,上海200241 |
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| 摘 要： | 由单芯片封装器件构成的系统越来越不能满足航电设备用户求，而片上系统（SOC）设计目前尚不能真正实现系统集成。封装内系统技术能以较低成本投入换来尺寸的大幅减小、重量大幅减轻、封装效率提高、电气特性提升、功耗降低及可靠性提高等等优势，综合性能得到大大提升，是性价比很高的技术。
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| 关 键 词： | 航电设备小型化 封装内系统（SIP） 多芯片模块（MCM） 片上系统（SOC） |
Application of System in Package Technologyin Avionics Minimization |
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| WANG Yi,WANG Jing-dian,LIU Jian-zhong. Application of System in Package Technologyin Avionics Minimization[J]. Avionics Technology, 2013, 0(4): 51-55 |
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| Authors: | WANG Yi WANG Jing-dian LIU Jian-zhong |
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| Affiliation: | 1.Aeronautical Military Representative Bureau Resident in Shanghai Region for The Naval Force, Shan ghai 200233, China; 2. China National Aeronautical Radio Electronics Research Institute, Shanghai 200241, China) |
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| Abstract: | System composed of chips with single die cannot meet the requirements of avionics in near future, and system cannot be implemented with System on Chip （SoC） technology at present Yet with System in Package （SIP） technology, system can be optimized for cost, performance, size, weight, power and reliability. SIP is more cost-effective and faster-to-market than SoC. SIP has many applications in avionics in American and European countries. It＇s valuable to adopt SIP to domestic avionics minimization development. |
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| Keywords: | avionics minimization system-in-package （SIP） multi-chip-module （MCM） system on chip （SOC） |
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